Integrated GHz Voltage Controlled Oscillators

Kinget, Peter R.

doi:10.1007/978-1-4757-3047-0_17

Cited by 176 publications

(67 citation statements)

References 18 publications

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“…The commonly used definition of FoM is [11] FoM (43) where is the power consumption expressed in mW. If we double the current consumption in the SS-VCO, doubles as well, becoming equal to .…”

Section: Phase-noise Figure-of-meritmentioning

confidence: 99%

More on the $1/{\rm f}^{2}$ Phase Noise Performance of CMOS Differential-Pair LC-Tank Oscillators

Andreani

Fard

2006

IEEE J. Solid-State Circuits

133

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Abstract-This paper presents a rigorous phase noise analysis in the 1 f 2 region for the differential CMOS LC-tank oscillator with both nMOS and pMOS switch pairs. A compact, closed-form phase noise equation is obtained, accounting for the noise contributions from both tank losses and transistors currents, which allows a robust comparison between LC oscillators built with either one or two switch pairs.The fabricated oscillator prototype is tunable between 2.15 and 2.35 GHz, and shows a phase noise of 144 dBc/Hz at 3 MHz offset from the 2.3 GHz carrier for a 4 mA bias current. The phase noise figure-of-merit is practically constant across the tuning range, with a minimum of 191.5 dBc/Hz. A reference single-switch-pair oscillator has been implemented and tested as well, and the difference between the phase noise levels displayed by the two oscillators is very nearly the one expected from theory.

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Section: Phase-noise Figure-of-meritmentioning

confidence: 99%

More on the $1/{\rm f}^{2}$ Phase Noise Performance of CMOS Differential-Pair LC-Tank Oscillators

Andreani

Fard

2006

IEEE J. Solid-State Circuits

133

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“…By resorting to chip-package co-design methodologies, all the active components and biasing circuitry can be integrated onto a small size die (Ͻ 1 mm 2 ). Finally, the die can be wire-bonded or flip-chip-bonded on to the LCP substrate that provides the high-Q passive com- [19] and is restated as follows:…”

Section: Resultsmentioning

confidence: 99%

A novel miniaturized feedback LC oscillator for UMTS-type applications in 3D stacked liquid crystalline polymer technology

Bavisi

Swaminathan

Dalmia³

et al. 2006

Int J RF and Microwave Comp Aid Eng

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This article presents the design and implementation of a feedback LC oscillator in a novel multilayer laminate-type process technology that uses multiple layers of liquid crystalline polymer (LCP) substrate. The 1.8-GHz oscillator is designed using high-qualityfactor (Q) lumped-element passives that are embedded in the LCP substrate. The oscillator was fabricated on a large area, high Q integrated process technology employing six metal layers with an overall height (thickness) of 0.7 mm. The microstrip-type oscillator utilizes silicon bipolar device technology and measures a phase noise of ؊117 dBc/Hz at 100-KHz offset. Including the output buffer, the fully packaged oscillator occupies an area of 5.3 ؋ 4.8 mm 2 and, under steady state, the oscillator consumes 10 mW from a 2.7-V power supply.

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“…The 7-GHz tuning range is implemented using a varactor with continuous tuning, and the additional margin for PVT compensation is implemented using a digitally controlled bank of switched capacitors, as described in the following section. The continuous tuning range , along with the center frequency , and the inductor set the value of the varactor [16] (1)…”

Section: B Design Processmentioning

confidence: 99%