Integrated microscale cooling for concentrator solar cells

Plesz, Balázs; Takács, Gábor; Szabó, Péter; Kohári, Zsolt; Németh, Márton; Bognár, G.

doi:10.1109/dtip.2017.7984487

Cited by 3 publications

(2 citation statements)

References 8 publications

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“…The distance between the centerlines of the channels is 300 mm. The effective length of the channels is 6 mm which were optimized with thermal simulations [44]. Each channel has an inlet at the center line of the cell and two outlet openings on the edges that are suitable to circulate liquid coolant.…”

Section: Mask Designing and Geometriesmentioning

confidence: 99%

Integrated cooling solution for concentrator photovoltaic cells

Rózsás

Bognár

Takács

et al. 2021

Pollack

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The efficiency of the most modern photovoltaic cells currently reaches 40–45%, which is achieved by concentrator systems. However, despite better device efficiencies concentrator photovoltaic cells have major drawback, namely the high amount of waste heat, which requires new cooling solutions.This paper gives a short overview of the current cooling techniques and proposes a novel microchannel cooling solution for concentrator photovoltaic cells. In the concept, the microscale channels are integrated into the backside metallization of the PV device. The paper gives a description of the technological process that can be used to produce microchannels on the back of solar cells and shows the optimization of the channels to achieve optimal cooling performance.

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Section: Mask Designing and Geometriesmentioning

confidence: 99%

Integrated cooling solution for concentrator photovoltaic cells

Rózsás

Bognár

Takács

et al. 2021

Pollack

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“…So as a consequence, during the last phase of the project the applicability and the realization possibilities of the integration of microscale channel based heat sink structures to the concentrated photovoltaic cells for integrated thermostating purpose were investigated (Fig. 11) [30].…”

Section: Characterization Of Concentrated Photovoltaic Cells (Cpv) Anmentioning

confidence: 99%

Integrated Thermal Management in System-on-Package Devices

Bognár¹,

Takács²,

Szabó³

et al. 2019

Period. Polytech. Elec. Eng. Comp. Sci.

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Thanks to the System-on-Package technology (SoP) the integration of different elements into a single package was enabled. However, from the thermal point of view the heat removal path in modern packaging technologies (FCBGA) goes through several layers of thermal interface material (TIM) that together with the package material create a relatively high thermal resistance which may lead to elevated chip temperature which causes functional error or other malfunctions. In our concept, we overcome this problem by creating integrated microfluidic channel based heat sink structures that can be used for cooling the high heat dissipation semiconductor devices (e.g.: processors, high power transistor or concentrated solar cells). These microchannel cooling assemblies can be integrated into the backside of the substrate of the semiconductor devices or into the system assemblies in SoP technology. In addition to the realization of the novel CMOS compatible microscale cooling device we have developed precise and valid measurement methodology, simulation cases studies and a unique compact model that can be added to numerical simulators as an external node. In this paper the achievements of a larger research are summarized as it required the cooperation of several experts in their fields to fulfil the goal of creating a state-of-the-art demonstrator. Thanks to the System-on-Package technology (SoP) the integration of different elements into a single package was enabled. However, from the thermal point of view the heat removal path in modern packaging technologies (FCBGA) goes through several layers of thermal interface material (TIM) that together with the package material create a relatively high thermal resistance which may lead to elevated chip temperature which causes functional error or other malfunctions. In our concept, we overcome this problem by creating integrated microfluidic channel based heat sink structures that can be used for cooling the high heat dissipation semiconductor devices (e.g.: processors, high power transistor or concentrated solar cells). These microchannel cooling assemblies can be integrated into the backside of the substrate of the semiconductor devices or into the system assemblies in SoP technology. In addition to the realization of the novel CMOS compatible microscale cooling device we have developed precise and valid measurement methodology, simulation cases studies and a unique compact model that can be added to numerical simulators as an external node. In this paper the achievements of a larger research are summarized as it required the cooperation of several experts in their fields to fulfil the goal of creating a state-of-the-art demonstrator.

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