2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2015
DOI: 10.1109/sispad.2015.7292341
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Integrated modeling platform for High-k/alternate channel material heterostructure stacks

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Cited by 4 publications
(2 citation statements)
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“…The additional error in the latter bias region is attributed to the fact that the Since the extent of the ionic potential tails beyond the chalcogen lattice sites is comparable to the vdW gap, the electrical thickness of the thin MLs is a few angstroms more than the physical thickness determined by the lattice atom positions. Now it is verified using a finite difference 1D Poisson solver [25] that the thickness of the MLs per se do not impact the electrostatic simulations. However, their increased electrical thickness reduces the effective (electrical) interlayer separation.…”
Section: Resultsmentioning
confidence: 91%
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“…The additional error in the latter bias region is attributed to the fact that the Since the extent of the ionic potential tails beyond the chalcogen lattice sites is comparable to the vdW gap, the electrical thickness of the thin MLs is a few angstroms more than the physical thickness determined by the lattice atom positions. Now it is verified using a finite difference 1D Poisson solver [25] that the thickness of the MLs per se do not impact the electrostatic simulations. However, their increased electrical thickness reduces the effective (electrical) interlayer separation.…”
Section: Resultsmentioning
confidence: 91%
“…This would also suggest a finite thickness of the MLs. However, using a 1D finite difference Poisson solver [25] we found that the band alignments in vdW stacks are insensitive to the wave nature of electrons/holes for reasonable values of κ. Therefore we concluded that it is not the spread in the wavefunction that causes the error in the electrostatic model.…”
mentioning
confidence: 93%