Integrated Multifunctional Environmental Sensors

Roozeboom, C. L.; Hopcroft, Matthew A.; Smith, W. S.; Sim, Joo Yong; Wickeraad, D. A.; Hartwell, P.G.; Pruitt, Beth L.

doi:10.1109/jmems.2013.2245400

Cited by 38 publications

(12 citation statements)

References 41 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Multi-function devices have been a subject of intense research in recent years. Roozeboom et al integrated multiple sensors (temperature, humidity, light intensity, pressure, wind speed, wind direction, magnetic field, and acceleration) in a single MEMS device [1]. Lee et al also fabricated micro voltage, temperature, and humidity sensors and integrated them on a stainless steel foil [2].…”

Section: Introductionmentioning

confidence: 99%

Self-powered hybrid humidity sensor and dual-band UV photodetector fabricated on back-contact photovoltaic cell

Juan

Chang

Hsueh

et al. 2015

Sensors and Actuators B: Chemical

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 99%

Self-powered hybrid humidity sensor and dual-band UV photodetector fabricated on back-contact photovoltaic cell

Juan

Chang

Hsueh

et al. 2015

Sensors and Actuators B: Chemical

View full text Add to dashboard Cite

“…The trends in magnetometer and capacitive accelerometers are somewhat scattered and do not show a clear trend. A straight line fit of the data approximates the TCS, although some of the trends are not clearly linear [3].…”

Section: Temperature Coefficient Of Sensitivitymentioning

confidence: 92%

“…In industry, new commercial sensors like the Analog Devices ADIS16405 and the STMicroelectronics LSM33D combine three-axis gyroscopes, accelerometers, and magnetometers in a single package. In our lab, we have previously developed a multifunctional sensor called MFISes [2][3] that measures ten parameters on a single chip: temperature, humidity, light intensity, pressure, air speed, air flow direction, magnetic field, and three-axis acceleration ( Table 1). MFISes is an ideal platform for crosssensitivity experiments because the sensors are integrated on a single device and experience identical test conditions without gradients or time delay.…”

Section: Introductionmentioning

confidence: 99%

Integrated sensor cross-sensitivity analysis

Roozeboom

Salgado

Hopcroft

et al. 2013

2013 Transducers &Amp; Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems

View full text Add to dashboard Cite

We present data and analysis of sensor crosssensitivities to a range of environmental conditions: temperature, humidity, light intensity, air flow, magnetic field, and acceleration. We used previously developed multifunctional integrated sensors (MFISes) with ten functions on a single chip as the test platform. We quantify the effect of test conditions on sensor offset and sensitivity, examine the fundamental mechanisms of the cross-sensitivities, and compare the performance of different transduction principles. The data and analysis is key to enabling the use of multifunctional sensors and is applicable to general sensor design and operation.

show abstract

“…There are quite a few examples reported in the literature [2,3,4,5,6,7,8,9,10,11,12], where multiple sensors have been integrated on a single MEMS chip. Generally, the need to cluster more than one sensor on a chip arises when the investigators are designing a sensor system intended for a specific industrial/scientific application.…”

Section: Introductionmentioning

confidence: 99%

An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications

Mansoor

Haneef

Akhtar

et al. 2016

Sensors

View full text Add to dashboard Cite

An SOI CMOS multi-sensor MEMS chip, which can simultaneously measure temperature, pressure and flow rate, has been reported. The multi-sensor chip has been designed keeping in view the requirements of researchers interested in experimental fluid dynamics. The chip contains ten thermodiodes (temperature sensors), a piezoresistive-type pressure sensor and nine hot film-based flow rate sensors fabricated within the oxide layer of the SOI wafers. The silicon dioxide layers with embedded sensors are relieved from the substrate as membranes with the help of a single DRIE step after chip fabrication from a commercial CMOS foundry. Very dense sensor packing per unit area of the chip has been enabled by using technologies/processes like SOI, CMOS and DRIE. Independent apparatuses were used for the characterization of each sensor. With a drive current of 10 µA–0.1 µA, the thermodiodes exhibited sensitivities of 1.41 mV/°C–1.79 mV/°C in the range 20–300 °C. The sensitivity of the pressure sensor was 0.0686 mV/(Vexcit kPa) with a non-linearity of 0.25% between 0 and 69 kPa above ambient pressure. Packaged in a micro-channel, the flow rate sensor has a linearized sensitivity of 17.3 mV/(L/min)−0.1 in the tested range of 0–4.7 L/min. The multi-sensor chip can be used for simultaneous measurement of fluid pressure, temperature and flow rate in fluidic experiments and aerospace/automotive/biomedical/process industries.

show abstract

Integrated Multifunctional Environmental Sensors

Cited by 38 publications

References 41 publications

Self-powered hybrid humidity sensor and dual-band UV photodetector fabricated on back-contact photovoltaic cell

Self-powered hybrid humidity sensor and dual-band UV photodetector fabricated on back-contact photovoltaic cell

Integrated sensor cross-sensitivity analysis

An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications

Contact Info

Product

Resources

About