Integrated planar optical imaging system with high interconnection density

Jahns, Jürgen; Acklin, B.

doi:10.1364/ol.18.001594

Cited by 45 publications

(14 citation statements)

References 5 publications

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“…Optical interconnects provide a solution for high-speed interconnects between chips or fiber systems to solve the inherent limits of the existing electrical interconnects in operating speed, density of packaging and power dissipation [44][45][46]. Optical interconnects are also an important application of planar integrated systems and by using on-axis and off-axis imaging properties of planar integrated micro-optics, parallel and crossover interconnects can be implemented [47][48][49][50][51][52][53][54][55][56]. For optical interconnects, the planar system requires a large SBP (space-bandwidth product) for space-invariant operations employing the same connection [57][58][59].…”

Section: Parallel and Crossover Interconnects In Grin Planar Opticsmentioning

confidence: 99%

Design of GRIN optical components for coupling and interconnects

Gómez-Reino¹,

Pérez²,

Bao³

et al. 2008

Laser & Photonics Reviews

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This paper reviews the design of some optical systems for coupling and interconnection by GRIN components. The optical systems designed with these components are based on imaging and transforming properties of such components to carry out specific functions. First of all, a brief description of light propagation through GRIN materials will be given. After that, a device to couple light by a GRIN fiber lens into fibers of different core sizes with low loss is described. The coupling efficiency as well as the coupling loss are studied versus variation of the GRIN fiber lens length and the refractive-index profile of the coupler. The design of crossover and parallel interconnects by using a GRIN planar structure will be presented. The optical analysis includes the PSF for describing the performance of the device and the SBP for estimating the numbers of channels that can be handled. The dependence of the number of channels on the wavelength of light and the transverse aperture of the planar interconnect is shown.Spherical GRIN materials: Luneburg (top) and Maxwell's fisheye (bottom) lenses.

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Section: Parallel and Crossover Interconnects In Grin Planar Opticsmentioning

confidence: 99%

Design of GRIN optical components for coupling and interconnects

Gómez-Reino¹,

Pérez²,

Bao³

et al. 2008

Laser & Photonics Reviews

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“…Both constraints can be written as g W ; a 2 W z y π ≤ ≤ (8) Likewise, the size w x and w y of the diffraction-limited image spot can be evaluated as the separation between +1 st and -1 st minima of the diffraction pattern produced by a rectangular pupil of W y and W z dimensions taking into account the inherent imaging capability due to the GRIN nature. …”

Section: Spatial Bandwidth Productmentioning

confidence: 99%

“…Optical interconnects provide a solution for high speed interconnects between chips or fiber systems to solve the inherent limits of the existing electrical interconnects in operating speed, dense packaging and power dissipation [2][3][4] . Optical interconnects are also an important application of planar integrated systems and by using on-axis and off-axis imaging properties of planar integrated microoptics, parallel and crossover interconnects can be implemented [5][6][7][8][9][10][11][12][13][14] . For optical interconnects, the planar system requires a large SBP (space-bandwidth product) for space invariant operations employing the same connection [15][16][17] .…”

Section: Introductionmentioning

confidence: 99%

Design of reconfigurable GRIN planar optical interconnects

et al. 2008

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Design of all-optics reconfigurable GRIN (Gradient-Index) planar structure for crossover and parallel interconnects will be presented. Design represents a unique combination of GRIN materials, simple geometry optics and waveguide technology for both parallel and distributed processing and communication networks. The optical analysis is based onaxis and off-axis multiple imaging property of GRIN components. The analysis includes the study of the Point Spread Function (PSF) for describing the performance of the GRIN planar structure and the evaluation of the Space Bandwidth Product (SBP) for estimating the number of channels which can be handled. The dependence of the number of channels on the wavelength of the light and the aperture of the planar interconnect is shown. The results are given for five working wavelengths of Laser Diode (LD) and for four transverse aperture of reconfigurable optical interconnect.

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“…1͒ and propagates along it until it meets an out-coupling optical element and goes to the detector. Diffractive lenses as coupling optical elements have many advantages [3][4][5] and have been suggested also in the context of quasi-optics 6 for rapidly expanding terahertz technology. 7 However, their intrinsic dependence of optical properties on the wavelength-chromaticity-poses difficult problems.…”

mentioning

confidence: 99%

Mechanical means for temperature compensation of planar diffractive optical interconnects: feasibility study

Socol¹

2006

Opt. Eng

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Abstract. Planar diffractive optical interconnects have many advantages, however, their inherent chromaticity leads to temperature instability due to the wavelength shift of laser diodes' radiation. This shift can be compensated if the optical interconnect is bended in an appropriate direction with curvature proportional to the relative wavelength shift. The bending can be performed by attaching an additional plate to the element with a different thermal expansion coefficient. Theoretical analysis and ray tracing are reported. In the semiconductor industry, there is a continually aggravating problem of increasing communication volume. Optical interconnection technology is seen as a prime option for solving this problem.1,2 In planar optical interconnects ͑POI͒ light is injected ͑by an in-coupling optical element͒ into a transparent slab ͑light guide͒ at a total internal reflection angle ͑ in Fig. 1͒ and propagates along it until it meets an out-coupling optical element and goes to the detector. Diffractive lenses as coupling optical elements have many advantages [3][4][5] and have been suggested also in the context of quasi-optics 6 for rapidly expanding terahertz technology.7 However, their intrinsic dependence of optical properties on the wavelength-chromaticity-poses difficult problems.8 Chromaticity leads also to temperature instability. Namely, the wavelength of semiconductor lasers is temperature-dependent. Temperature change causes wavelength shift, therefore the laser beam as deflected by the diffractive in-coupling optical element deviates from its desired path and can miss the out-coupling element. For example, for a typical 850-nm vertical-cavity surfaceemitting lasers ͑VCSEL͒ source the wavelength shift is d / dT = 0.06 nm/ K, 9 i.e., relative wavelength shift is ͑1/͒͑d / dT͒ϳ7 ϫ 10 −5 K −1 . If POI was assembeled at 20°C, the working temperature is 140°C ͑Max3905 from Dallas Semiconductors, e.g.͒, and the POI length is 10 cm, the resulting beam deviation is about 1.7 mm ͑see below the calculation͒. This temperature instability is specific for diffracive POI since other thermal effects are much less: e.g., for fused silica the explicit refraction index temperature dependence is −3 ϫ 10 −6 K −1 . 10 The implicit temperature dependence ͑due to the refraction index wavelength dependence dn / d and the laser wavelength shift d / dT͒ is even smaller: dn / d =4ϫ 10 −5 nm −1 , 10 leading to dn / dT = ͑dn / d͒͑d / dT͒ = 2.4ϫ 10 −7 K −1 . We propose to fix this problem by bending POI in accordance to the temperature change. We suppose that POI and the laser have the same temperature since they are close to each other. A simple bending scheme is absolutely passive and implies attaching to POI a second plate, having different thermal expansion coefficient ͑in mass production, the attachment may be done by lamination technology 11 ͒. The curvature of this bending is proportional to the temperature change ͑as long as the thermal expansion can be considered as linear with temperature͒. As long as the laser wavelen...

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Integrated planar optical imaging system with high interconnection density

Cited by 45 publications

References 5 publications

Design of GRIN optical components for coupling and interconnects

Design of GRIN optical components for coupling and interconnects

Design of reconfigurable GRIN planar optical interconnects

Mechanical means for temperature compensation of planar diffractive optical interconnects: feasibility study

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