Abstract:Abstract-Design techniques are presented for the realization of high-performance integrated interference suppression filters using bond-wire inductors. A new configuration is proposed for mitigating the impact of mutual coupling between the bond wires. A differential low-noise amplifier with an integrated on-chip passive interference suppression filter is designed at 2.1 GHz in a 0.18-m CMOS process, and achieves a transmit leakage suppression of 10 dB at 190-MHz offset. The differential filter uses metal-insu… Show more
“…A front-end on-chip high-Q passive-filter using bond wires is presented in [14], see is extremely challenging because of the lack of high-Q integrated inductors in the frequency bands up to 5 GHz. In [14], a three-pole differential bandpass filter at 2.14 GHz using bond-wire inductors is presented.…”
Section: Other Cancellation Techniquesmentioning
confidence: 99%
“…A front-end on-chip high-Q passive-filter using bond wires is presented in [14], see is extremely challenging because of the lack of high-Q integrated inductors in the frequency bands up to 5 GHz. In [14], a three-pole differential bandpass filter at 2.14 GHz using bond-wire inductors is presented. Since the TX and RX are usually separated by only a hundred megahertz, even with a third order bandpass filter, the TX leakage suppression is no more than 10dB [14].…”
Section: Other Cancellation Techniquesmentioning
confidence: 99%
“…In [14], a three-pole differential bandpass filter at 2.14 GHz using bond-wire inductors is presented. Since the TX and RX are usually separated by only a hundred megahertz, even with a third order bandpass filter, the TX leakage suppression is no more than 10dB [14].…”
Section: Other Cancellation Techniquesmentioning
confidence: 99%
“…Equation (3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14) describes the tradeoffs between the transmitter and receiver insertion loss and a graphical interpretation is shown in Fig. 3-13.…”
Section: Fig 3-11 Three Port Integrated Duplexermentioning
“…A front-end on-chip high-Q passive-filter using bond wires is presented in [14], see is extremely challenging because of the lack of high-Q integrated inductors in the frequency bands up to 5 GHz. In [14], a three-pole differential bandpass filter at 2.14 GHz using bond-wire inductors is presented.…”
Section: Other Cancellation Techniquesmentioning
confidence: 99%
“…A front-end on-chip high-Q passive-filter using bond wires is presented in [14], see is extremely challenging because of the lack of high-Q integrated inductors in the frequency bands up to 5 GHz. In [14], a three-pole differential bandpass filter at 2.14 GHz using bond-wire inductors is presented. Since the TX and RX are usually separated by only a hundred megahertz, even with a third order bandpass filter, the TX leakage suppression is no more than 10dB [14].…”
Section: Other Cancellation Techniquesmentioning
confidence: 99%
“…In [14], a three-pole differential bandpass filter at 2.14 GHz using bond-wire inductors is presented. Since the TX and RX are usually separated by only a hundred megahertz, even with a third order bandpass filter, the TX leakage suppression is no more than 10dB [14].…”
Section: Other Cancellation Techniquesmentioning
confidence: 99%
“…Equation (3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14) describes the tradeoffs between the transmitter and receiver insertion loss and a graphical interpretation is shown in Fig. 3-13.…”
Section: Fig 3-11 Three Port Integrated Duplexermentioning
“…However, they can be exploited in the transmitter chain after the up-conversion mixer where the required DR is not demanding [36]. Also in [37], a high-order LC BPF by exploiting high Q-factor bond wires has been implemented which have more than 10 dB of insertion loss. An extensive comparison table is given in [24].…”
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