2008
DOI: 10.1109/tmtt.2008.921297
|View full text |Cite
|
Sign up to set email alerts
|

Integrated RF Interference Suppression Filter Design Using Bond-Wire Inductors

Abstract: Abstract-Design techniques are presented for the realization of high-performance integrated interference suppression filters using bond-wire inductors. A new configuration is proposed for mitigating the impact of mutual coupling between the bond wires. A differential low-noise amplifier with an integrated on-chip passive interference suppression filter is designed at 2.1 GHz in a 0.18-m CMOS process, and achieves a transmit leakage suppression of 10 dB at 190-MHz offset. The differential filter uses metal-insu… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
26
0

Year Published

2014
2014
2019
2019

Publication Types

Select...
4
2
1

Relationship

0
7

Authors

Journals

citations
Cited by 36 publications
(26 citation statements)
references
References 29 publications
0
26
0
Order By: Relevance
“…A front-end on-chip high-Q passive-filter using bond wires is presented in [14], see is extremely challenging because of the lack of high-Q integrated inductors in the frequency bands up to 5 GHz. In [14], a three-pole differential bandpass filter at 2.14 GHz using bond-wire inductors is presented.…”
Section: Other Cancellation Techniquesmentioning
confidence: 99%
See 3 more Smart Citations
“…A front-end on-chip high-Q passive-filter using bond wires is presented in [14], see is extremely challenging because of the lack of high-Q integrated inductors in the frequency bands up to 5 GHz. In [14], a three-pole differential bandpass filter at 2.14 GHz using bond-wire inductors is presented.…”
Section: Other Cancellation Techniquesmentioning
confidence: 99%
“…A front-end on-chip high-Q passive-filter using bond wires is presented in [14], see is extremely challenging because of the lack of high-Q integrated inductors in the frequency bands up to 5 GHz. In [14], a three-pole differential bandpass filter at 2.14 GHz using bond-wire inductors is presented. Since the TX and RX are usually separated by only a hundred megahertz, even with a third order bandpass filter, the TX leakage suppression is no more than 10dB [14].…”
Section: Other Cancellation Techniquesmentioning
confidence: 99%
See 2 more Smart Citations
“…However, they can be exploited in the transmitter chain after the up-conversion mixer where the required DR is not demanding [36]. Also in [37], a high-order LC BPF by exploiting high Q-factor bond wires has been implemented which have more than 10 dB of insertion loss. An extensive comparison table is given in [24].…”
Section: Frequency Response Stabilitymentioning
confidence: 99%