Abstract-Design techniques are presented for the realization of high-performance integrated interference suppression filters using bond-wire inductors. A new configuration is proposed for mitigating the impact of mutual coupling between the bond wires. A differential low-noise amplifier with an integrated on-chip passive interference suppression filter is designed at 2.1 GHz in a 0.18-m CMOS process, and achieves a transmit leakage suppression of 10 dB at 190-MHz offset. The differential filter uses metal-insulator-metal capacitors and bond-wire inductors and occupies only 0.22 mm 2 . The cascaded system achieves a measured gain of 9.5 dB with a 1.6-dB noise figure and 5 dBm out-of-band IIP 3 and consumes 11 mA from a 2-V supply.Index Terms-Bandpass filter (BPF), bond wires, CMOS, interference suppression, mutual inductance, wideband code division multiple access (WCDMA).

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