Integrated Rogowski Coil Sensor for Press-Pack Insulated Gate Bipolar Transistor Chips

Jiao, Chaoqun; Zhang, Zuoming; Zhao, Zhibin; Zhang, Xiumin

doi:10.3390/s20154080

Cited by 15 publications

(4 citation statements)

References 26 publications

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“…A PCB-base Rogowski coil can be seen in Figure 1 C [ 38 ]. This kind of coil requires more than one copper layer; for example, the coil reported in [ 51 ] is fabricated using four layers, as in Figure 4 . This last Rogowski coil is used as a sensor for press-pack insulated gate bipolar transistor chips.…”

Section: Printed Circuit Boards For Electronics Sensors and Actuatorsmentioning

confidence: 99%

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Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering

Perdigones

Quero

2022

Micromachines

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This paper describes the fabrication opportunities that Printed Circuit Boards (PCBs) offer for electronic and biomedical engineering. Historically, PCB substrates have been used to support the components of the electronic devices, linking them using copper lines, and providing input and output pads to connect the rest of the system. In addition, this kind of substrate is an emerging material for biomedical engineering thanks to its many interesting characteristics, such as its commercial availability at a low cost with very good tolerance and versatility, due to its multilayer characteristics; that is, the possibility of using several metals and substrate layers. The alternative uses of copper, gold, Flame Retardant 4 (FR4) and silver layers, together with the use of vias, solder masks and a rigid and flexible substrate, are noted. Among other uses, these characteristics have been using to develop many sensors, biosensors and actuators, and PCB-based lab-on chips; for example, deoxyribonucleic acid (DNA) amplification devices for Polymerase Chain Reaction (PCR). In addition, several applications of these devices are going to be noted in this paper, and two tables summarizing the layers’ functions are included in the discussion: the first one for metallic layers, and the second one for the vias, solder mask, flexible and rigid substrate functions.

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Section: Printed Circuit Boards For Electronics Sensors and Actuatorsmentioning

confidence: 99%

“… ( Top ) PCB Rogowski coil. ( Bottom ) four-layer board design pattern (reprinted from [ 51 ], copyright (2020), Creative Commons License). …”

Section: Figurementioning

confidence: 99%

Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering

Perdigones

Quero

2022

Micromachines

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“…Regarding current distribution in multi-chip modules, Rogowski coils have been widely used in the current distribution measurement because of their strong anti-interference ability and good linearity [59,60]. At present, the coils have been optimized to a thickness of 1 mm and integrated into the PCB [61].…”

Section: Characteristic Parameters Measurementmentioning

confidence: 99%

Overview of monitoring methods of press‐pack insulated gate bipolar transistor modules under different package failure modes

Liu

Yao

et al. 2022

IET Power Electronics

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Press-pack insulated gate bipolar transistor modules (PP-IGBTs) have been widely used in high-voltage and high-power-density applications, such as high-voltage direct-current (HVDC) converters, because of their advantages of low thermal resistance, double side cooling, and short-circuit failure mode. Package failure is one of the main reasons for IGBT module failure. Package condition monitoring is the key to realizing modules fault diagnosis, condition prediction, and intelligent operation and maintenance. At present, a variety of characteristic parameters, such as on voltage and junction temperature, are used in package condition monitoring. However, the characteristic parameters show different variation laws under different package degradation modes. Therefore, the relationship between package degradation modes and characteristic parameters is the key to realizing the condition monitoring, so as to improve the reliability of the power electronic system. In this paper, first, the package structure of a PP-IGBT is analyzed. Second, the mechanisms of fretting wear degradation, gate-oxide degradation, spring degradation, lid warping degradation, micro arcing degradation, short-circuit failure, and open-circuit failure are reviewed. The variation laws of characteristic parameters under each degradation and failure mode are then investigated. Finally, three difficult problems including characteristic parameter measurement, especially pressure monitoring, high-sensitivity detection, and characterization and evaluation, are discussed and analyzed.

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“…Hence, several Rogowski coil designs have been suggested in the literature. The Printed Circuit Board (PCB) design [24][25][26][27][28][29] is one of the most recent designs increasing the spread of Rogowski coil use in several electronic applications, as this design increases its suitability to be integrated with electronic systems and devices. On the other hand, Rogowski coil measurements can show some deviations from the expected values due to positional errors [30].…”

Section: Introductionmentioning

confidence: 99%

Measurement of Power Frequency Current including Low- and High-Order Harmonics Using a Rogowski Coil

El-Shahat

Eldin

Mohamed³

et al. 2022

Sensors

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The measurement of a power frequency current including low- and high-order harmonics is of great importance in calibration as well as in testing processes. Therefore, this paper presents the measurement of the power frequency current of light-emitting diode (LED) luminaires. LED luminaires were chosen as their input current includes both low- and high-order harmonics. The measurement process depends on reconstructing an LED luminaire current without using the coil parameters. Hence, the current reconstruction process is designed to be dependent on the measured characteristics of the Rogowski coil itself considering the frequency range at which the measurement process is required. An evaluation of the proposed measurement process was theoretically and experimentally carried out. A theoretical evaluation was carried out using MATALB SIMULINK software. However, the experimental evaluation was performed by building a Rogowski coil to measure the input currents of different LED luminaires having different power ratings of 300 W, 400 W, and 600 W. The currents measured using the Rogowski coil were compared with reference currents measured using a standard measurement technique. The obtained results show the efficacy of the proposed measurement method.

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Integrated Rogowski Coil Sensor for Press-Pack Insulated Gate Bipolar Transistor Chips

Cited by 15 publications

References 26 publications

Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering

Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering

Overview of monitoring methods of press‐pack insulated gate bipolar transistor modules under different package failure modes

Measurement of Power Frequency Current including Low- and High-Order Harmonics Using a Rogowski Coil

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