2004
DOI: 10.1016/j.microrel.2003.07.004
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Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

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Cited by 105 publications
(47 citation statements)
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“…Although recent improvements in the mechanical properties of molding compounds, plastic package designs, and manufacturing technologies have resulted in substantial increase in the reliability of plastic packages, there still exists one major industry-wide concern associated with these packages -their moisture-induced failures ("popcorn" cracking) [55][56][57] . Such failures typically occur during surface mounting the packages onto PCBs using high temperature (220˚C-280˚C) reflow soldering.…”
Section: Thin Films Polymeric Materials and Plastic Packages Of Ic Dmentioning
confidence: 99%
“…Although recent improvements in the mechanical properties of molding compounds, plastic package designs, and manufacturing technologies have resulted in substantial increase in the reliability of plastic packages, there still exists one major industry-wide concern associated with these packages -their moisture-induced failures ("popcorn" cracking) [55][56][57] . Such failures typically occur during surface mounting the packages onto PCBs using high temperature (220˚C-280˚C) reflow soldering.…”
Section: Thin Films Polymeric Materials and Plastic Packages Of Ic Dmentioning
confidence: 99%
“…Fick's second law can be applied to describe the moisture diffusion process in polymer materials [1][2][3][4][5][6][7][8][9][10][11][12][13]. According to Fick's second law, moisture diffusion in a material is defined by Fickian diffusion law in three dimensions as follows [23]:…”
Section: Characterization Of Moisture Diffusion and Hygroscopic Swellmentioning
confidence: 99%
“…The moisture diffusion coefficient D and moisture saturation concentration C sat of epoxy molding compound and die attach materials are listed in Table 1. In this study, material parameters of the die attach from [11] are used since the same die attach material is used in both studies.…”
Section: Characterization Of Moisture Diffusion and Hygroscopic Swellmentioning
confidence: 99%
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