Integrating chip-level microfluidics cooling into system level design of digital circuits

Bognár, G.; Takács, Gábor; Pohl, László; Jani, Lazar; Timar, Andras; Horváth, Péter; Németh, Márton; Poppe, A.; Szabó, Péter

doi:10.1109/semi-therm.2017.7896912

Cited by 2 publications

(1 citation statement)

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“…An essential step to gain a model was the division of the channel into several segments and for each segment a T-equivalent circuit is created. The ladder-type thermal model obtained by applying the T-equivalent subcircuit as a building block can be used as a compact model of microscale channel structures [17,18,24].…”

Section: Numerical Analysis and Modellingmentioning

confidence: 99%

Integrated Thermal Management in System-on-Package Devices

Bognár¹,

Takács²,

Szabó³

et al. 2019

Period. Polytech. Elec. Eng. Comp. Sci.

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Thanks to the System-on-Package technology (SoP) the integration of different elements into a single package was enabled. However, from the thermal point of view the heat removal path in modern packaging technologies (FCBGA) goes through several layers of thermal interface material (TIM) that together with the package material create a relatively high thermal resistance which may lead to elevated chip temperature which causes functional error or other malfunctions. In our concept, we overcome this problem by creating integrated microfluidic channel based heat sink structures that can be used for cooling the high heat dissipation semiconductor devices (e.g.: processors, high power transistor or concentrated solar cells). These microchannel cooling assemblies can be integrated into the backside of the substrate of the semiconductor devices or into the system assemblies in SoP technology. In addition to the realization of the novel CMOS compatible microscale cooling device we have developed precise and valid measurement methodology, simulation cases studies and a unique compact model that can be added to numerical simulators as an external node. In this paper the achievements of a larger research are summarized as it required the cooperation of several experts in their fields to fulfil the goal of creating a state-of-the-art demonstrator. Thanks to the System-on-Package technology (SoP) the integration of different elements into a single package was enabled. However, from the thermal point of view the heat removal path in modern packaging technologies (FCBGA) goes through several layers of thermal interface material (TIM) that together with the package material create a relatively high thermal resistance which may lead to elevated chip temperature which causes functional error or other malfunctions. In our concept, we overcome this problem by creating integrated microfluidic channel based heat sink structures that can be used for cooling the high heat dissipation semiconductor devices (e.g.: processors, high power transistor or concentrated solar cells). These microchannel cooling assemblies can be integrated into the backside of the substrate of the semiconductor devices or into the system assemblies in SoP technology. In addition to the realization of the novel CMOS compatible microscale cooling device we have developed precise and valid measurement methodology, simulation cases studies and a unique compact model that can be added to numerical simulators as an external node. In this paper the achievements of a larger research are summarized as it required the cooperation of several experts in their fields to fulfil the goal of creating a state-of-the-art demonstrator.

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Section: Numerical Analysis and Modellingmentioning

confidence: 99%