Integrating Extended Non-destructive Testing in the Life Cycle Management of Bonded Products—Some Perspectives

Abstract

In this chapter, we outline some perspectives on embracing the datasets gathered using Extended Non-destructive Testing (ENDT) during manufacturing or repair process steps within the life cycle of bonded products. Ensuring that the ENDT data and metadata are FAIR, i.e. findable, accessible, interoperable and re-usable, will support the relevant stakeholders in exploiting the contained material-related information far beyond a stop/go decision, while a shorter time-to-information will facilitate a prompter time-to-decision in process and product management. Exploiting the value of ENDT (meta)data will contribute to increased performance by integrating all defined, measured, analyzed and controlled aspects of material transformation across process and company boundaries. This will facilitate the optimization of manufacturing and repair operations, boosting their energy efficiency and productivity. In this regard, some aspects that are currently driving activities in the field of pre-process, in-process and post-process quality assessment will be addressed in the following. Furthermore, some requirements will be contemplated for harmonized and conjoint data transfer ranging from a bonded product’s beginning-of-life through its end-of-life, the customization of stand-alone or linked ENDT tools, and the implementation of sensor arrays and networks in joints, devices and structural parts to gather material-related data during a product’s middle-of-life application phase, thereby fostering structural health monitoring (SHM).

Precepts for Designing Sandwich Materials

“…They found an increase of 299% in the shear strength of the DP590-CFRP-DP590 SMs, where laser treatment was applied to improve the adhesive bonding between DP590 and CFRP. Due to the excellent adhesion between metal and polymer via this technique, it is highly favoured in the automotive and aircraft industries [41,42]. This technique can also be used for the preparation of biocompatible MPM SMs for biomedical applications; however, the problem lies in the preparation route, as generally cytotoxic epoxy-based adhesives are used in this technique [27,43,44].…”

Detailed Finite Element Models for the Simulation of the Laser Shock Wave Response of 3D Woven Composites

“…Novel aircraft engine fan blades utilize a multi-material structure composed of a 3D woven CFRP core partially covered by an adhesively bonded thin metallic layer. The endof-life management (reuse or recycle) of such a configuration involves many challenges, with one of them being the disassembly of the components [1][2][3]. Numerous methodologies have been explored to address the debonding challenge, encompassing various physical and chemical phenomena [4].…”

Automated bondline thickness quantification in adhesively joined composites and metals using ultrasound

“…7 There is a high sensitivity of the bondline integrity due to the presence of defects and voids that can compromise the strength of the bonded area and negatively affect the overall structural performance. 10 These defects can be a result of contaminations in the substrate surfaces or can occur due to the nonuniform spread of the adhesive during the bonding process. The quality of the bonds can also depend on various environmental conditions like temperature, surface preparation, and load distribution between the fibers and adherent such as shown in Ma et al 11 In addition to enhancing the performance of the adhesive by proper control of the geometrical separation of the materials being bonded, several authors have added microparticles to the adhesive.…”

“…Adhesives are also able to provide electrical insulation, improved fatigue strength, and shock absorption 7 . There is a high sensitivity of the bondline integrity due to the presence of defects and voids that can compromise the strength of the bonded area and negatively affect the overall structural performance 10 . These defects can be a result of contaminations in the substrate surfaces or can occur due to the nonuniform spread of the adhesive during the bonding process.…”