The scope of the present work is to experimentally investigate the effect of pre‐bond contamination with de‐icing (DI) fluid and the combined effect of DI fluid and hygrothermal ageing on the fracture toughness of carbon fibre reinforced plastic bonded joints. These scenarios could occur in the implementation of an adhesively bonded patch repair in a composite aircraft structural part. To this end, mode I and mode II fracture toughness tests were conducted on contaminated specimens and mode II fracture toughness tests on contaminated/aged specimens. Three levels of contamination with a de‐icer were considered. The hygrothermal ageing conditions applied until saturation are 70°C/85% relative humidity. The experimental results reveal a detrimental effect of DI fluid on both mode I and mode II fracture toughness of the bonded joints. With increasing the contamination level, the mode I and mode II critical energy release rates decrease. Under mode I loading, the specimens failed mainly in light‐fibre‐tear mode, while under mode II loading, in adhesive failure mode. Hygrothermal ageing decreased further the mode II fracture toughness of the specimens and increased the adhesive failure mode. The present study reveals that the pre‐bond DI contamination and after‐bond ageing could critically degrade the strength of adhesively bonded patch repairs.

The effect of hygrothermal aging on the mechanical behaviour of polyamide 6 (PA6) material filled with 10 wt % multi-walled carbon nanotubes (MWCNTs) has been investigated experimentally. Young's modulus and flexural modulus of the materials are decreased by more than 30% for the conditions of 25°C/85% RH, compared to the reference conditions of 25°C/55% RH (RT), while the flexural strength by 6-17%. The decrease is larger for the conditions of 40°C/85% RH, which reveals that the effect of combined elevated temperature and moisture is more severe. The decrease in the properties is smaller for the MWCNT/PA6 specimens, which shows that the presence of MWCNTs mitigates the effect of hygrothermal aging. Finally, it is observed that the increase in the properties of the MWCNT/PA6 material is so large, for the specific MWCNT concentration, that it compensates the negative effect of hygrothermal aging.

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In this chapter, we outline some perspectives on embracing the datasets gathered using Extended Non-destructive Testing (ENDT) during manufacturing or repair process steps within the life cycle of bonded products. Ensuring that the ENDT data and metadata are FAIR, i.e. findable, accessible, interoperable and re-usable, will support the relevant stakeholders in exploiting the contained material-related information far beyond a stop/go decision, while a shorter time-to-information will facilitate a prompter time-to-decision in process and product management. Exploiting the value of ENDT (meta)data will contribute to increased performance by integrating all defined, measured, analyzed and controlled aspects of material transformation across process and company boundaries. This will facilitate the optimization of manufacturing and repair operations, boosting their energy efficiency and productivity. In this regard, some aspects that are currently driving activities in the field of pre-process, in-process and post-process quality assessment will be addressed in the following. Furthermore, some requirements will be contemplated for harmonized and conjoint data transfer ranging from a bonded product’s beginning-of-life through its end-of-life, the customization of stand-alone or linked ENDT tools, and the implementation of sensor arrays and networks in joints, devices and structural parts to gather material-related data during a product’s middle-of-life application phase, thereby fostering structural health monitoring (SHM).

A B S T R A C TIn the present work, the effect of pre-bond contamination scenarios related to production and repair processes on the adhesion strength of composite-to-metal joints is investigated by means of the novel centrifuge testing technology. The composite substrates have been subjected to contamination with release agent, moisture, fingerprint, thermal degradation and de-icing fluid before being bonded on the metallic stamp. Different contamination levels have been considered for each scenario. The standard deviation of adhesion strength values differs for each sample category and in some cases, is relatively high. The experimental results show a considerable decrease of adhesion strength for all contamination scenarios. The evaluation of the adhesion strength values is assisted by the characterization of the failure modes. In most cases, the transition between the failure modes explains the variation of adhesion strength. By taking into advantage the simplicity of the experimental process, numerous tests have been conducted within a very short time. Based on the practicality of the experimental process and the validity of the findings, it can be concluded that the centrifuge testing technology can be potentially used as a reliable testing method for the characterization of bonded joints.