2009 IEEE Custom Integrated Circuits Conference 2009
DOI: 10.1109/cicc.2009.5280823
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Integrating magnetics for on-chip power: Challenges and opportunities

Abstract: Integration of efficient power converters requires a technology for efficient, high-power on-chip inductors. The state of the art is reviewed, and possible future developments are discussed for both air-core and magnetic-core inductors. Performance limits and scaling are analyzed. General design possibilities are outlined and different approaches are compared. Magnetic materials are reviewed, and nano-granular composite materials are highlighted as an attractive option. IEEE 2009 Custom Intergrated Circuits Co… Show more

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Cited by 51 publications
(30 citation statements)
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“…This composite signal has been tested for two different waveforms' frequencies: on the left 100 kHz and on the right 500 kHz. From the measurement of v and i, H and B have been calculated applying (1) and (2). The hysteresis loops related to the different waveforms are highlighted with different colors.…”
Section: Test Signal With Multiple Waveforms and DC Biasmentioning
confidence: 99%
See 1 more Smart Citation
“…This composite signal has been tested for two different waveforms' frequencies: on the left 100 kHz and on the right 500 kHz. From the measurement of v and i, H and B have been calculated applying (1) and (2). The hysteresis loops related to the different waveforms are highlighted with different colors.…”
Section: Test Signal With Multiple Waveforms and DC Biasmentioning
confidence: 99%
“…Both solutions are currently evaluated in the above mentioned range of frequencies, while it seems that magnetic-core still presents a higher inductance density with respect to aircore ones. [2][3][4][5] For this reason, it is important to evaluate new magnetic materials capable to work at high frequency and with technological properties compatible with miniaturization.…”
Section: Introductionmentioning
confidence: 99%
“…Magnetic components with high efficiency, high power density and low profile are needed for integration in power-supplyin-package and/or power-supply-on-chip [3]- [7]. Toroidal inductors have attractive geometries compared to solenoids and planar spirals, as they have little external field, which can cause electromagnetic interference and induce eddy-current loss in nearby conductors [8]- [11].…”
Section: Introductionmentioning
confidence: 99%
“…The second category is embedded inductors, in which the inductors are embedded inside the Si substrate and utilize the unused substrate volume. Consequently, the inductor height above the substrate surface can be lowered, which is an advantage for integrated circuit implementation 14 . Si-embedded inductors are also an attractive solution for the advanced packaging of ultra-compact power supplies with the passive interposer 24 .…”
Section: Introductionmentioning
confidence: 99%
“…In the VHF range, inductors with an air core or non-magnetic core are preferred, as suitable magnetic materials working at these frequencies are limited and the core implementation is very challenging 13 . For example, at 50 MHz, NiZn and CoNiZn have low magnetic saturation fluxes and cause detrimental core heating in high-flux power electronics applications 14 . In addition, VHF converters require inductance values of 10 s of nH, which is in the inductance range of air-core inductors, thereby lending themselves to a promising solution 15 .…”
Section: Introductionmentioning
confidence: 99%