2006
DOI: 10.1109/tnano.2005.861399
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Integrating nanowires with substrates using directed assembly and nanoscale soldering

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Cited by 65 publications
(23 citation statements)
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“…One-dimensional nanostructures such as carbon nanotubes, semiconductor, metal and polymer nanowires exhibit unique electrical, optical and mechanical properties that can be exploited for biochemical sensing [1][2][3][4][5][6][7][8][9], nanomechanical actuation [10][11][12][13][14] and nanoelectronics [15][16][17][18][19][20][21][22][23]. Highly sensitive sensors can be achieved by utilizing a onedimensional nanostructure due to their extremely high surfaceto-volume ratio [1].…”
Section: Introductionmentioning
confidence: 99%
“…One-dimensional nanostructures such as carbon nanotubes, semiconductor, metal and polymer nanowires exhibit unique electrical, optical and mechanical properties that can be exploited for biochemical sensing [1][2][3][4][5][6][7][8][9], nanomechanical actuation [10][11][12][13][14] and nanoelectronics [15][16][17][18][19][20][21][22][23]. Highly sensitive sensors can be achieved by utilizing a onedimensional nanostructure due to their extremely high surfaceto-volume ratio [1].…”
Section: Introductionmentioning
confidence: 99%
“…The scalability of this technique needs further investigation. The proposed assembling method using molten solder can be applied to integrate nanowires with a solder-padded substrate [22]. Another possible application is the assembly of two-dimensional structures to form three-dimensional solids [24].…”
Section: Resultsmentioning
confidence: 99%
“…Methods of assembling parts using molten solder or liquid have been developed with different driving mechanisms [15,16,[18][19][20][21][22][23]. By minimizing the surface energy of molten solder balls, Harsh et al [19] demonstrated an assembly of a hinged plate through controlling the solder volume.…”
Section: Introductionmentioning
confidence: 99%
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“…However, such physical methods are expensive and not pliable to large areas. Although solder reflow [8,10] is a reliable method for soldering positioned 1D nanomaterials between electrodes, it is tedious and not tractable to all nanoscale structures as the process involves integrating the solder segments to 1D nanomaterials during the synthesis. Hence, a solution-processed method with minimal contamination is of great importance to solder 1D nanomaterials.…”
Section: Introductionmentioning
confidence: 99%