2012
DOI: 10.1109/lpt.2012.2211344
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Integration of Edge-Emitting Laser Diodes With Dielectric Waveguides on Silicon

Abstract: Edge-emitting 1.55-µm platelet InGaAs/InP laser diodes are bonded in 6.5-µm-deep recesses etched into a thick SiO 2 layer on an Si substrate so that they are aligned and coaxially coupled to SiON dielectric waveguides fabricated within the SiO 2 layer. The integrated lasers show room temperature pulsed and continuous wave (CW) lasing at threshold currents of 17 and 19 mA, respectively. The CW output power measured from the end of the dielectric waveguide at the edge of the chip is more than 1 mW, and laser-to-… Show more

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Cited by 5 publications
(7 citation statements)
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“…The positional accuracy is at the limit of what would be useful in terms of the associated coupling losses, and the angular accuracy would be good enough for components that are not far from each other [5,17]. Future work involves the design of a strategy to electrically contact the microlasers.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The positional accuracy is at the limit of what would be useful in terms of the associated coupling losses, and the angular accuracy would be good enough for components that are not far from each other [5,17]. Future work involves the design of a strategy to electrically contact the microlasers.…”
Section: Resultsmentioning
confidence: 99%
“…Several approaches have been proposed to overcome the lack of an efficient, electrically pumped silicon laser that could be monolithically integrated in a silicon photonics platform. The most promising of these approaches are heteroepitaxial growth of germanium or III-V compounds on silicon [1], wafer bonding [2][3][4] and active alignment with pick and place tools [5].…”
Section: Introductionmentioning
confidence: 99%
“…As an alternative, I would suggest that the Ge diffraction grating present on some III-V DFB ICL devices be bonded upside down on a Ge waveguide 67 . Another hybrid approach is to mount an edge-emitting/detecting III-V active "die" in a trench etched at one end of a group IV waveguide for end-fire coupling into the guide 68 . Membrane transfer and bonding is also a fine approach.…”
Section: Active Iii-v Devices Hybrid-integrated On Si or Gementioning
confidence: 99%
“…And the heteroepitaxial growth of In x Ga 1 − x As films on Si substrates are expected to be used for the fabrication of high-efficiency solar cells [6,7], laser diodes [8,9], photodetectors [10,11], and so on. In particular, the In x Ga 1 − x As with high In composition of 0.53 is a promising candidate III-V compound semiconductor for a metal-oxide-semiconductor field-effect transistor (MOSFET) channel material due to its high electronic mobility and high breakdown field [12,13].…”
Section: Introductionmentioning
confidence: 99%