Integration of electronic components in the thermoplastic processing chain: possibilities through additive manufacturing using conductive materials

Morais, Manuel V. C.; Reidel, Robin; Weiß, Patrick; Baumann, Sascha; Hübner, Christof; Henning, Frank

doi:10.1109/icmid.2018.8527054

Cited by 7 publications

(3 citation statements)

References 4 publications

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“…Among these processes, Arburg Plastic Freeforming (APF) has emerged in recent years as a promising technology for the manufacturing of highly detailed parts with a wide range of thermoplastic materials (Morais et al , 2018; Hirsch et al , 2019). This process melts and pressurizes the polymeric material by means of a heated reciprocating screw.…”

Section: Introductionmentioning

confidence: 99%

Effect of selected process parameters on dimensional accuracy in Arburg Plastic Freeforming

Mele

Pisaneschi

Campana

et al. 2022

RPJ

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Purpose The body of the literature on the Arburg Plastic Freeforming process is still very limited despite the increasing industrial importance of this technology. This paper aims to contribute to a better understanding of this technology by investigating relations between characteristic process parameters and part features. Particularly, the effects of nominal dimension, drop aspect ratio, build chamber temperature and part position on accuracy are investigated. The density of manufactured parts is also measured to understand its relation with dimensional error. Design/methodology/approach A benchmark part was designed and manufactured in Polycarbonate on an Arburg Plastic Freeformer 2K-3A. The process was repeated with two levels of drop aspect ratio (1.2125 and 1.2150) and two build chamber temperatures (90°C and 120°C). Each build job included five parts in different positions of the chamber. The dimensional accuracy of benchmarks was measured by using a digital caliper, while Archimede’s principle was used for density measurements. All the acquired results were processed through an analysis of variance to investigate the role of experimental factors. Findings Results demonstrate that the linear shrinkage occurring at the end of the 3D printing process is the main source of inaccuracy. The higher the building chamber temperature, the most the part accuracy is influenced by the nominal dimension. The drop aspect ratio affects the dimensional error in the XY plane by increasing the overlap of adjacent droplets. On the other hand, this parameter does not influence the accuracy along the Z direction. The position of the parts inside the building chamber exhibited an influence on results, arguably due to the hot airflows. Research limitations/implications This research did not allow for a complete understanding of the role of part positioning on part accuracy. Further study is needed to understand the detail of this phenomenon. Practical implications The results of this study can aid the users of Arburg Plastic Freeforming technology by uncovering the role of the main process parameters. Originality/value This paper expands the body of knowledge on the Arburg Plastic Freeforming process by providing new information on the role of the main process parameters on dimensional accuracy and density. Particularly, the results answer a research question on the role of the drop aspect ratio, demonstrating that its main effect is to vary the droplets overlap, which, in turn, affects the thermal shrinkage.

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Section: Introductionmentioning

confidence: 99%

Effect of selected process parameters on dimensional accuracy in Arburg Plastic Freeforming

Mele

Pisaneschi

Campana

et al. 2022

RPJ

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“…nanoimprinting [9] or 3D-printing [10][11][12]. For the printing of the electronic circuits, conductive inks based on electrically conductive particles are used.…”

Section: Introductionmentioning

confidence: 99%

Capacitive and illumination systems based on printed and hybrid electronics

Peřinka¹,

Pozo²,

Gorostiza³

et al. 2021

Flex. Print. Electron.

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Functional electronic systems have been screen- or inkjet-printed on different plastic substrates, including polyethylene terephthalate, polycarbonate and polycarbonate/acrylonitrile butadiene styrene blends. Mutual capacitive sensors were designed and printed on flexible substrates and the capacitive response and functionality of the printed sensor with integrated passive electronic components was demonstrated. The applicability of both, inkjet printing and screen printing for the development of such capacitive sensors was evaluated. The influence of the substrate, sensor design and the printing technique parameters on both printability and functionality are discussed. Further, a flexible illumination system was developed, where the printed circuit was combined with surface mounted light emitting diodes and integrated circuits. Finally, the developed capacitive sensors and the illumination system were connected to each other to demonstrate the connectivity and interoperability of the different printed circuit components.

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“…In particular, new process chains have been proposed to integrate printed circuits on injection molded parts using direct-write onto the plastic surface [29]. However, typical direct-write printing would require printing on difficult-to-reach areas, such as slots or internal surfaces to create complex geometries [30]. Moreover, the surface roughness, structures adhesion, and mechanical resistance of AM circuits can be critical factors in some applications, such as RF and sensing.…”

Section: Introductionmentioning

confidence: 99%

Hybrid Process Chain for the Integration of Direct Ink Writing and Polymer Injection Molding

et al. 2020

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The integration of additive manufacturing direct-writing technologies with injection molding provides a novel method to combine functional features into plastic products, and could enable mass-manufacturing of custom-molded plastic parts. In this work, direct-write technology is used to deposit conductive ink traces on the surface of an injection mold. After curing on the mold surface, the printed trace is transferred into the plastic part by exploiting the high temperature and pressure of a thermoplastic polymer melt flow. The transfer of the traces is controlled by interlocking with the polymer system, which creates strong plastic/ink interfacial bonding. The hybrid process chain uses designed mold/ink surface interactions to manufacture stable ink/polymer interfaces. Here, the process chain is proposed and validated through systematic interfacial analysis including feature fidelity, mechanical properties, adhesion, mold topography, surface energy, and hot polymer contact angle.

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Integration of electronic components in the thermoplastic processing chain: possibilities through additive manufacturing using conductive materials

Cited by 7 publications

References 4 publications

Effect of selected process parameters on dimensional accuracy in Arburg Plastic Freeforming

Effect of selected process parameters on dimensional accuracy in Arburg Plastic Freeforming

Capacitive and illumination systems based on printed and hybrid electronics

Hybrid Process Chain for the Integration of Direct Ink Writing and Polymer Injection Molding

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