Integration of laser die transfer and magnetic self-assembly for ultra-thin chip placement

Abstract

In this paper, we demonstrate the integration of a novel self-assembly method with laser die transfer for ultra-thin chip (UTC) placement. The laser die transfer technique provides high speed chip presentation into the assembly positions on the substrate, where the magnetic self-assembly traps and aligns the chips. Combination of these two technologies allows handling of UTCs without a direct mechanical contact throughout the assembly flow and provides high precision chip placement.

Laser‐Induced Forward Transfer: Fundamentals and Applications

“…Other groups have shown the viability of this technique in the placement of individual devices with precision and speeds competitive with well‐established pick‐and‐place tools . More recent reports have implemented external magnetic fields for trapping and alignment of the individual chips in order to improve device orientation, thus minimizing rotation during placement . Finally, it is worth noting the ability of the lase‐and‐place technique to transfer ultra‐thin (≈10 µm) silicon substrates up to 1 mm 2 , which despite their fragility can be laser‐placed at their target location with precisions of ±10 µm without any signs of damage or fracture after transfer onto the acceptor substrate…”

Nonlinear design, analysis, and testing of a single-stage compliant orthogonal displacement amplifier with a single input force for microgrippers

“…Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI. such as chip placement [1], teleoperated microsurgery [2], and microassembly [3]. Microgrippers, which grasp, transport, place, and release micro/nanoscale objects, are typical micro/nanomanipulation end effectors [4][5][6].…”