This paper proposes a classification scheme for the quantified analysis of micro‐grip principles. Micro‐part gripping has received quite some attention in micro‐assembly research. However, there is a lack of quantified data on the characteristics and applicability of micro‐grip principles. The micro‐grip principle is the physical principle that produces the necessary forces to get and maintain a part in a position with respect to the gripper. The classification scheme defines criteria that are essential in the evaluation and selection of a micro‐grip principle for gripping a given part. The criteria are defined on the basis of characteristics of the parts to be gripped, demands on the grip operation to be performed and characteristics of the environment in which the grip operation takes place. The classification scheme is evaluated using examples from literature.

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Surface-enhanced Raman scattering (SERS) substrates are of great interest for detecting low-concentrated analytes. However, issues such as multistep processing, cost, and possible presence of hazardous substances in the fabrication still represent a significant drawback. In this paper, an innovative direct writing method is introduced for solvent-free and spatially selective deposition of fine metal copper nanoparticles (CuNPs), with size distribution below 20 nm, generated in-line through a spark ablation method (SAM). The deposited CuNPs’ morphology and composition were characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM), and energy-dispersive X-ray spectroscopy (EDS). The resulting CuNP patterns feature porous 3D microdomains with nanometric structures serving as hot spots for Raman signal enhancement. Low-temperature post-treatment (below 200 °C) of the deposited CuNPs significantly evolves its morphology and leads to sintering of NPs into a semicrystalline structure with sharp geometric features, which resulted in a more than 10-fold increase of the enhancement factor (up to 2.1 × 105) compared to non-heat-treated samples. The proposed method allows creating SERS substrates constituted by sharp 3D metallic nanopatterns selectively deposited onto specific regions, which paves the way for new printed, highly sensitive SERS-based sensors.

The paper describes the first fabrication and experimental results in the on-going development of MEMS-based electrothermal actuation devices for lateral XY positioning of an optical fibre to a laser diode chip to improve their coupling efficiency and reduce the overall packaging cost. The deflection performance of bulk silicon U-and V-beam thermal actuators with and without fibre loading has been experimentally determined. This is a part of an investigation of the feasibility of an alternative method of performing micro-assembly tasks, i.e. by means of product-internal assembly functions.

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