Integration of segmented 3D image data measured by projected fringe profilometry

Abstract

A novel integration technique for segmented 3D profiles measured by projected fringe profilometry is proposed. This method is able to match images successfully even in the presence of geometric deformations, illumination changes, and severe occlusions. Tests of the system performance have been carried out that accuracy of the registration scheme is one part in one hundred of one pixel. This technique is superior to the other methods because of its higher accuracy, improved robustness, and reduced computational cost.

The Membrane Thickness Prediction of Solder Paste Process by Phase-Shifting Projection

“…The process of phase unwrapped uses the original phase to multiply multiples of 2π and then plus (or subtract) the wrapped phase φ to recreate the discontinuous original phase. The unwrapping phase is known as an independent phase or the expanded phase [4].…”

“…The methodology used in the measurement of tin thickness is Phase-shifting Projected Fringe, a three-dimensional morphology measurement technology. The demand in various industries of this technology has increased greatly, such as the morphology identification of missile, fish radar and wing screw paddle in the defense industry, biological cells in medical engineering and PC board in electronic industry [4].…”

Integration of segmented 3D image data measured by projected fringe profilometry using supercontinuum light

“…The matched surface points provided sufficient information to determine the rotation matrix R and the translation vector T [11]. Thus, the transformed data sets can then be assembled together in the same reference system.…”

Projected fringe profilometry using a supercontinum light illumination for micro-scale measurements

“…The entire surface is sampled simultaneously with minimum requirements to the mechanical fixture. In addition to its full-field measurement capability, projected fringe profilometry is also notable for the non-contact nature, fast measurement speed, high profile sampling density, and low environmental vulnerability [6][7][8][9].…”