Intelligent Design and Tuning Method for Embedded Thermoelectric Cooler (TEC) in 3-D Integrated Microsystems

Zhang, Peng; Wang, Da-Wei; Zhao, Wen‐Sheng; You, Bin; Liu, Jun; Cheng, Qian; Xu, Hao

doi:10.1109/tcpmt.2023.3292185

Cited by 6 publications

(2 citation statements)

References 29 publications

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“…However, a few companies have taken the initial steps to commercialize micro-thermoelectric technology in applications such as micro-coolers and micro-generators. TEC-Microsystems [69], for instance, is one of the active and leading manufacturers that commercializes micro thermoelectric generators for small-scale energy harvesting. It designs and manufactures standard micro-TEGs, advanced micro-TEGs with high density (up to 1200 particles per square centimeter), and micro-TEGs with custom and unique applications.…”

Section: Thermoelectric Energy Harvestingmentioning

confidence: 99%

Converting Human Power into Electricity: Current Status and Future Directions

Ding,

Yang,

Cui

2023

Preprint

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This comprehensive review explores the principles, applications, and future directions of human-powered energy generation technologies. It begins by providing a detailed examination of viable human energy sources, elucidating the physical principles behind various energy harvesting devices. The review then compiles and assesses existing products in the field of human power generation, while also outlining the opportunities and challenges it presents. Finally, an innovative concept of an eco-village system is introduced to demonstrate a future potential application scenario for human-generated electricity. It outlines two developmental stages for this system and underscores its significance in the construction of the harmonious and sustainable communities. This forward-thinking approach could pave the way for broader discussions on sustainable living and eco-friendly energy generation in a world increasingly focused on environmental concerns and social stability.

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Section: Thermoelectric Energy Harvestingmentioning

confidence: 99%

Converting Human Power into Electricity: Current Status and Future Directions

Ding,

Yang,

Cui

2023

Preprint

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“…1(b). Recent discussions by Zhang et al 12 have delved into the optimization of a micro-TEC embedded within a cavity etched in the thermal interface material (TIM) layer atop a 3D integrated architecture and this setup connects to a heat spreader layer. Nevertheless, challenges emerge when photonic and electronic chips within a 2.5D configuration possess different thicknesses, leading to varying thicknesses of the TIM layer connected to the heat spreader.…”

mentioning

confidence: 99%

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Gupta,

Tanwar,

et al. 2024

J. Optical Microsystems

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Managing the temperature of photonic chips within intricate electro-optic packages poses a notable challenge concerning the thermal crosstalk between the photonic chip, electronic chip, and the chip-fiber connection point. This is a multifaceted problem and requires packaging solutions that cannot only address high-performance thermal management but must also be scalable to high volumes. Glass has long been thought of as a suitable platform for next-generation photonic packaging due to its low thermal conductivity, which minimizes unwanted heat transfer between electronic and photonic components. Achieving proper thermal isolation between the chips and the chip-fiber interface necessitates a microscale thermal solution that guarantees accurate temperature regulation of the photonic circuitry without disrupting the optical coupling interface with the fiber array, due to the presence of epoxy used for fiber attachment. We propose a technique for the development of a substrate-integrated microthermoelectric cooler (SimTEC) for the effective temperature control of the electronic and photonic integrated devices. The proposed device uses glass substrate vias that are half-filled with p and n-type thermoelectric materials and the other half with copper. A COMSOL multiphysics model is developed to study the variations in the cooling performance of this SimTEC device based on changes in the via parameters. Interestingly, the maximum range of temperature gradient variation for SimTEC is 6 times greater compared to that of equivalent free-standing micro-TEC pillars. However, there are some challenges associated with implementing this method, as the temperature gradient (or cooling effect) achieved by SimTEC still falls short of that achieved by the free-standing micro-TEC pillars.

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Thermoelectric cooler with embedded teardrop-shaped milli-channel heat sink for electronics cooling

Liu,

Zheng,

et al. 2024

Applied Thermal Engineering

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Intelligent Design and Tuning Method for Embedded Thermoelectric Cooler (TEC) in 3-D Integrated Microsystems

Cited by 6 publications

References 29 publications

Converting Human Power into Electricity: Current Status and Future Directions

Converting Human Power into Electricity: Current Status and Future Directions

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Thermoelectric cooler with embedded teardrop-shaped milli-channel heat sink for electronics cooling

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