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Thermal crosstalk in a highly integrated RRAM array due to the self-heating effect is one of the most critical issues affecting device reliability. In this paper, two types of ''thermal-house'' structures are proposed to optimize the thermal management of the RRAM array. An in-house developed parallel simulator is employed to study the performance of the proposed thermal house structures in terms of resistance ratio and crosstalk temperature. It is demonstrated that the proposed thermal house structures can help to reduce thermal crosstalk in high-density RRAM arrays. Some suggestions are also provided for further improving the thermal management capability of the thermal houses as well.INDEX TERMS Electrothermal simulation, low power consumption, parallel simulator, resistive-switching random access memory (RRAM), thermal-house, thermal management, thermal crosstalk.

A hybrid finite volume-finite element method which can avoid overestimation of volume shared by each vertex in the meshing grid is proposed to solve the diffusive transport governed continuity equation. The simulation results demonstrate that the improved algorithm can eliminate unphysical distortions as compared to the conventional Scharfetter Gummel method. Based on the proposed algorithm, a parallel-computation simulator is developed for large-scale electrothermal simulation of resistive random access memory (RRAM) arrays, in which the domain decomposition method and J parallel adaptive unstructured mesh applications infrastructure are adopted. The validity, speedup, and scalability of the parallel simulator are investigated on the TianHe-2 supercomputer. Based on the simulated results, the electrothermal characteristics and reliability analysis of large-scale RRAM arrays are investigated in detail. INDEX TERMS Domain decomposition method (DDM), drift diffusion, electrothermal modeling and simulation, finite element method (FEM), finite volume method (FVM), reliability, resistive random access memory (RRAM), thermal crosstalk.

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