Inter-layer crosstalk management in differential dual-striplines

Xiao, Kai; Hsu, Jimmy; Li, Yuanliang; Kunze, Richard K.; Ren, Yi; Nguyen, Trung-Thu

doi:10.1109/isemc.2013.6670505

Cited by 9 publications

(1 citation statement)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, a dual-stripline has interlayer crosstalk. Therefore, to enhance the signal integrity caused by this crosstalk, the authors in [7] used orthogonally overlapped traces in the differential signals.…”

Section: Introductionmentioning

confidence: 99%

Signal integrity analysis of system interconnection module of high‐density server supporting serial RapidIO

Kwon

et al. 2019

ETRI Journal

View full text Add to dashboard Cite

In this paper, we analyzed the signal integrity of a system interconnection module for a proposed high‐density server. The proposed server integrates several components into a chassis. Therefore, the proposed server can access multiple computing resources. To support the system interconnection, among the highly integrated computing resources, the interconnection module, which is based on Serial RapidIO, has been newly adopted and supports a bandwidth of 800 Gbps while routing 160 differential signal traces. The module was designed for two different stack‐up types on a printed circuit board. Each module was designed into 12‐ (version 1) and 14‐layer (version 2) versions with thicknesses of 1.5T and 1.8T, respectively. Version 1 has a structure with two consecutive high‐speed signal‐layers in the middle of two power planes, whereas Version 2 has a single high‐speed signal placed only in the space between two power planes. To analyze the signal integrity of the module, we probed the S‐parameters, eye‐diagrams, and crosstalk voltages. The results show that the high‐speed signal integrity of Version 2 has a better quality than Version 1, even if the signal trace length is increased.

show abstract

Section: Introductionmentioning

confidence: 99%