2020
DOI: 10.3390/designs4020014
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Interconnections for Additively Manufactured Hybridized Printed Electronics in Harsh Environments

Abstract: The ability to fabricate functional 3D conductive elements via additive manufacturing has opened up a unique sector of ‘hybridized printed electronics’. In doing so, many of the rigid standards (i.e., planar circuit boards, potting, etc.,) of traditional electronics are abandoned. However, one critical challenge lies in producing robust and reliable interconnections between conductive inks and traditional hardware, especially when subjected to harsh environments. This research examines select material pairings… Show more

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Cited by 6 publications
(1 citation statement)
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“…Therefore, the maximum applicable force until the samples' connections failed before and after damp-heat treatment was determined using a tensile test device. In a recent study, Neff et al [55] thoroughly studied the performance of conductive epoxy and low temperature solder for hybrid electronics in harsh environments, employing wire bond pull testing as well as high acceleration drop tower testing. In contrast to the present work, they focussed on the evaluation of one type of substrate while their micro-dispensed layer was notably thicker than the inkjet-printed structures.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, the maximum applicable force until the samples' connections failed before and after damp-heat treatment was determined using a tensile test device. In a recent study, Neff et al [55] thoroughly studied the performance of conductive epoxy and low temperature solder for hybrid electronics in harsh environments, employing wire bond pull testing as well as high acceleration drop tower testing. In contrast to the present work, they focussed on the evaluation of one type of substrate while their micro-dispensed layer was notably thicker than the inkjet-printed structures.…”
Section: Introductionmentioning
confidence: 99%