1997 Topical Symposium on Millimeter Waves. Proceedings (Cat. No.97TH8274)
DOI: 10.1109/tsmw.1997.702444
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Interconnects and packaging of millimeter wave circuits

Abstract: This contribution presents a number of aspects relevant for interconnects and packaging of monolithic integrated circuits, possibly combined with hybrid or even waveguide circuits in the millimeter-wave range. Examples of different iinterconnects and two realized front-ends are demonstrated. L INTRODUCTIONIn recent years, great efforts have been undertaken to develop mm-wave monolitluc integrated circuits (MIMICS) which now are being introduced into radar [l], [8] and communication equipment [2]. Especially fo… Show more

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Cited by 10 publications
(1 citation statement)
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“…It has an integrated metal insert for thermal management, an integrated wave-guide antenna, and glued feed-throughs for biasing and IF signals. The interconnects are made by compensated bonds [29,30]. Road condition recognition A radar beam directed directly towards the road surface contains information on the condition of the road.…”
Section: Antennamentioning
confidence: 99%
“…It has an integrated metal insert for thermal management, an integrated wave-guide antenna, and glued feed-throughs for biasing and IF signals. The interconnects are made by compensated bonds [29,30]. Road condition recognition A radar beam directed directly towards the road surface contains information on the condition of the road.…”
Section: Antennamentioning
confidence: 99%