Design aspects of microwave components with LTCC technique

Jantunen, Heli; Kangasvieri, T.; Vähäkangas, Jouko; Leppävuori, S.

doi:10.1016/s0955-2219(03)00155-9

Cited by 121 publications

(74 citation statements)

References 26 publications

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“…The performance requirement for LTCC materials is quite similar to that for conventional elecroceramics, such as microwave ceramics and package materials [17][18][19]. However, the LTCC technology requires more strict processing requirements to the ceramic materials [6,10,[20][21][22]，the general requirement are as follows.…”

Section: Physical and Processing Characters Of Ltcc Materialsmentioning

confidence: 99%

Towards rational design of low-temperature co-fired ceramic (LTCC) materials

Zhou¹

2012

J Adv Ceram

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Abstract:High performance low temperature co-fired ceramic (LTCC) dielectrics is highly desired for next generation information technology. The rational design is a key issue for the development of new LTCC materials. In comparison to the design of conventional electroceramics, more attention should be paid on the formation process of the material structure for that of LTCC, in addition to the physical properties, due to the special requirement in fabrication processing. In this paper, sintering mechanism of three types of LTCC materials, i.e., glass-ceramics, glass ceramic composite, and glass bonded ceramics, as well as important factors of their dielectric properties are discussed and summarized, and the design strategies for LTCC dielectrics, based on new matrix materials with much lower sintering temperature or higher quality, are proposed. As an example for rational design, oxyfluoride glass-ceramic based dielectrics, a new class of LTCC materials with low ε r , is analyzed.

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Section: Physical and Processing Characters Of Ltcc Materialsmentioning

confidence: 99%

Towards rational design of low-temperature co-fired ceramic (LTCC) materials

Zhou¹

2012

J Adv Ceram

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“…This technique enables substrates to be downsized by containing passive functions in the substrates. 12) 19) Recently, low-profile substrates have become more important due to the demand for the miniaturization of electronic components. However, LTCC substrates are becoming thin, so they easily break during the manufacturing process or actual usage.…”

Section: Introductionmentioning

confidence: 99%

Mechanical strength of low-temperature co-fired ceramic multi-layered substrate

Sakamoto

Fujita

Sugimoto

et al. 2017

J. Ceram. Soc. Japan

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We developed a structure of a mechanical-strength-enhanced low-temperature co-fired ceramic (LTCC) substrate using two LTCC materials with different thermal expansion coefficients (TECs). In this structure, the top and bottom surface layers are made of a material with a lower TEC and the internal layers are made of another material with a higher TEC. Because compressive stress was thought to be exerted in the surface layer due to the differences in the TECs between two materials, it was expected that the compressive stress would reinforce the surface. We found that the bending strength of the substrate was more than 400 MPa and considerably higher than that of each material. The results of stress analysis using the finite element method indicate that the fracture stress of the internal layer considerably exceeded the mechanical strength of the material comprising the internal layer. This is thought to be the cause of mechanical strength enhancement. Therefore, this proposed structure is promising for thinner multilayer substrates.

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“…7)17) Furthermore LTCCs have lower dielectric loss, which affects the highfrequency properties, than organic resin, which is generally used as an insulating materials in electronic circuits. 18) Therefore, LTCCs are suitable materials for constructing filters mounted in high-speed radio communication equipments. 19) 21) LTCC components usually have a multilayered circuit structure, because multiple green tapes of LTCC with via-holes and wiring conductors are laminated in the manufacturing process.…”

Section: Introductionmentioning

confidence: 99%

Dielectric properties of new LTCC material applied to high frequencies

Sugimoto

Mori

Moriya

et al. 2014

J. Ceram. Soc. Japan

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We have developed an LTCC (Low Temperature Co-fired Ceramics) material, which consists of Mg 2 SiO 4 , SrTiO 3 and highly crystallized LiMgZnBSiO glass. The material was able to be co-fired with inner cupper electrodes that have high electric conductivity. The dielectric constant is 8.8 and its Q value is 1620 at 25 GHz. Moreover, its temperature coefficient of dielectric constant¸¾ is +16 ppm/°C, which is much smaller than that of the LTCC material reported previously. Using the new LTCC material, band-pass filter (BPF) was successfully fabricated. The BPF had no defects such as delamination or cracks, and its filter properties were confirmed.

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Design aspects of microwave components with LTCC technique

Cited by 121 publications

References 26 publications

Towards rational design of low-temperature co-fired ceramic (LTCC) materials

Towards rational design of low-temperature co-fired ceramic (LTCC) materials

Mechanical strength of low-temperature co-fired ceramic multi-layered substrate

Dielectric properties of new LTCC material applied to high frequencies

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