Intercorrelated Relationship Between the Thermoelectric Performance and Mechanical Reliability of Mg2Si-Reduced Graphene Oxide Nanocomposites

Abstract

We fabricated Mg 2 Si-based thermoelectric nanocomposites with reduced graphene oxide using ultrasonic-based wet chemical pulverizing-mixing and spark plasma sintering to improve the trade-off relationship between thermoelectric properties and mechanical reliability. The dependence of thermoelectric properties and mechanical reliability on the nanophase morphologies has been systemically investigated, demonstrating the fracture toughness of the nanocomposite with thin reduced graphene oxide significantly increased. Moreover, the introduction of the few-layered reduced graphene oxide with high interface density was more effective in improving the trade-off relationship. This result suggests that an in-depth research on the dependence of the thermoelectric properties and mechanical reliability on the intrinsic properties of the nanophases is required to prepare efficient thermoelectric nanocomposites.

Fabrication of h-BN Filled Epoxy-Based Thermally Conductive Adhesive Tapes Containing Cyclic Carbonate-Terminated Oligomers

“…The complex viscosity of the compositions increased with increasing h-BN content and was dependent on the shear rate. While the flow resistance of the compositions increased by the physical interactions between polymers and fillers and the random orientation of fillers under low shear rates, it decreased with increasing shear rate because the physical interactions were broken followed by the filler alignment to the flow direction [37,19]. Therefore, the viscosity of the compositions containing h-BN fillers decreased with increasing shear rate.…”

“…Given that the higher the thermal conductivity of TIMs are the more rapidly the generated heat of the electronics spreads, a technique to attain TIMs with high thermal conductivity is crucial. To achieve this goal, much effort has been made to fabricate thermally conductive epoxy-and polysiloxane-based composites in which thermally conductive (TC) fillers, such as aluminum nitrides [9,10], aluminum oxides [11,12], hexagonal boron nitrides (h-BNs) [13][14][15], and carbonbased materials [16][17][18][19][20], are incorporated into the polymer matrix. Among these fillers, h-BNs possess high thermal conductivity stemming from the 2D structure formed by B − N networks and are electrically insulating [21] due to the localization of electrons on nitrogen atoms; therefore, they are widely used as TC fillers.…”

Effects of Se Doping on Thermoelectric Properties of Tetrahedrite Cu12Sb4S13−zSez

“…All the specimens showed positive values for p-type semiconductors in the measured temperature range. The Seebeck coefficient of the p-type semiconductor is expressed by α = (8∕3)π 2 k 2 B m * Te −1 h −2 (π∕3n) 2∕3 (k B : Boltzmann constant, h: Planck constant, m * : effective carrier mass, e: electronic charge, and n: carrier concentration) [18]. In general, as the temperature increases, the Seebeck coefficient increases and then decreases after reaching a peak, because the intrinsic transition occurs above a certain temperature, and thus the carrier concentration increases rapidly.…”