2019
DOI: 10.1088/1757-899x/522/1/012003
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Interface Damage of Protective Layer in TEM Lamella Preparation for Highly Doped Ge Substrate

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Cited by 3 publications
(1 citation statement)
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“…Then, a thicker metallic layer is deposited using the ionic beam (i-beam deposition). The e-beam deposition avoids surface degradation (and thus loss of thickness information on the topmost layer) due to direct impingement of the ionic beam on the surface [40]. The full workflow for the preparation of a cross-section using a FIB is visible in Figure 2.…”
Section: Ion Beam Cross-sectioningmentioning
confidence: 99%
“…Then, a thicker metallic layer is deposited using the ionic beam (i-beam deposition). The e-beam deposition avoids surface degradation (and thus loss of thickness information on the topmost layer) due to direct impingement of the ionic beam on the surface [40]. The full workflow for the preparation of a cross-section using a FIB is visible in Figure 2.…”
Section: Ion Beam Cross-sectioningmentioning
confidence: 99%