2022
DOI: 10.1021/acsaem.2c00400
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Interface Modification with Holistically Designed Push–Pull D–π–A Organic Small Molecule Facilitates Band Alignment Engineering, Efficient Defect Passivation, and Enhanced Hydrophobicity in Mixed Cation Planar Perovskite Solar Cells

Abstract: In perovskite solar cells, interfaces play a significant role in determining the device stability and device performance. Here, we introduce a versatile donor–π–acceptor (D–π–A) based organic small molecule (AA1) containing phenothiazine (PTZ) with a long alkyl chain as the donor unit, the vinyl-substituted thiophene moiety as a π bridge, and a rhodanine-(CN)2 moiety as an acceptor unit for the first time, and it was successfully deployed to passivate the defects at the surface and grain boundaries of a dual-c… Show more

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Cited by 17 publications
(18 citation statements)
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“…Similar PCE drops were observed in our previous reports that correlated very well with improved FF in low light intensities (0.2 sun), which justifies the thicker spiro-OMeTAD layer that is causing the FF drop under one sun test conditions. 29,37,66…”
Section: Resultsmentioning
confidence: 99%
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“…Similar PCE drops were observed in our previous reports that correlated very well with improved FF in low light intensities (0.2 sun), which justifies the thicker spiro-OMeTAD layer that is causing the FF drop under one sun test conditions. 29,37,66…”
Section: Resultsmentioning
confidence: 99%
“…32 By the Knoevenagel condensation reaction, compound 4 was reuxed with a rhodanine derivative in chloroform and acetic acid (1 : 4) to afford the nal compound AA6. 29,33 The spectral data of stepwise products including 1 H and 13 C NMR and HPLC mass spectra are provided in the ESI (Fig. S1-S9 †).…”
Section: Synthesis Procedures Of the Aa6 Moleculementioning
confidence: 99%
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“…This approach leverages the intrinsic defect‐tolerant structure of the perovskite, which minimizes nonradiative recombination and further provides high fluorescence quantum yields of the perovskite thin films. [ 13 ] The X‐ray image of an LM2907N voltage multiplier chip (Figure 1d) is taken using such an indirect conversion approach (see Section A‐i, Supporting Information), showing the buried circuitry in the marked area (Figure 1e). To determine the spatial resolution of this imaging technique, a Pearson fit of the line spread function was carried out (Figure 1f), yielding a maximum spatial resolution of 67.5 µm.…”
Section: Materials Characterization and Device Configurationmentioning
confidence: 99%