2015
DOI: 10.1016/j.infrared.2015.04.011
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Interface property of silicon nitride films grown by inductively coupled plasma chemical vapor deposition and plasma enhanced chemical vapor deposition on In0.82Al0.18As

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Cited by 7 publications
(3 citation statements)
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“…The design and fabrication of nanoporous materials are hot topics at the forefront of current materials science. With the availability of advanced nanoscopic design techniques including ion etching [1], chemical vapor deposition [2], and atomic manipulation via scanning tunneling electron microscopy [3], tailoring nanostructures to a specific design is not only possible, but the fabrication processes to achieve these nanostructures continue to increase in precision and viability. Nanopores bestow incredible characteristics upon materials such as high surface-tovolume ratios, increased catalytic power [4], high yield strength [5], and strain reversibility [6].…”
Section: Introductionmentioning
confidence: 99%
“…The design and fabrication of nanoporous materials are hot topics at the forefront of current materials science. With the availability of advanced nanoscopic design techniques including ion etching [1], chemical vapor deposition [2], and atomic manipulation via scanning tunneling electron microscopy [3], tailoring nanostructures to a specific design is not only possible, but the fabrication processes to achieve these nanostructures continue to increase in precision and viability. Nanopores bestow incredible characteristics upon materials such as high surface-tovolume ratios, increased catalytic power [4], high yield strength [5], and strain reversibility [6].…”
Section: Introductionmentioning
confidence: 99%
“…Extra H atoms incorporated in the hydrogen-rich silicon nitride layer are Si 3 N 4 network breakers, which also reduce the density of the layer. Both a larger amount of H and lower layer density are tending to increase the etching rate in the HF solution [13,16] . The BOE etching rate gradually increases from 0 for sample 1 to 35 nm/min for sample 3 as the NH 3 flow rate rises from 3 to 9.5 sccm, whereas it significantly increases from 35 to 230 nm/min as the NH 3 flow rate is further increased to 12 sccm for sample 4.…”
Section: Resultsmentioning
confidence: 99%
“…Chou et al [12] have developed the SiN x passivation technique at a lower-temperature using high-density ICP-CVD, which utilizes inductively coupled plasma to create high-density plasma (around 10 12 cm -3 ) in the processing reactor. High density plasma allows the deposition of high quality SiN x at lower temperatures below 150 ℃ [13] . Furthermore, the separation between deposition area and plasma generation area can reduce the surface damage deriving from energetic ion bombardment.…”
Section: Introductionmentioning
confidence: 99%