Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging

In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology

“…The formation of Cu 6 Sn 5 and Ag 3 Sn IMC is the core issue for Sn-Ag/Cu solder joint. Much work has been done on the formation and growth of IMC under different conditions for lead-free solder joints [2][3][4]. However, for Sn-Ag solder system when the silver content in is close to or more than eutectic composition, bulk Ag 3 Sn IMC plates are easily formed in the solder matrix or at the interfaces [5][6][7], which degrades the mechanical properties of solder joints [8][9][10].…”

Effects of Zn addition and aging treatment on tensile properties of Sn–Ag–Cu alloys

“…Near-ternary eutectic Sn-Ag-Cu alloys such as Sn-3Ag-0.5Cu or Sn-3.8Ag-0.7Cu are the most well-known Pb-free solders worldwide [7,8]. The wettability properties and interfacial reactions in the near-eutectic Sn-Ag-Cu alloys during soldering have been studied recently [9][10][11][12][13][14][15]. However, these alloys contain approximately 3 wt.% of Ag (an expensive metal), which makes them more expensive than other Pb-free solders.…”

Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints

“…Figure 3 shows the evolution of intermetallic compounds in the SnZnGa0.08Nd/Cu solder joints, the Cu 5-Zn 8 layer can be also detected by virtue of EDX testing, in which the thickness of intermetallic compound layer is smaller than that in SnZnGa/Cu solder joints after reflow soldering and during aging, thus it demonstrates that the addition of rare earth Nd can affect the intermetallic compound layer reaction during reflow soldering as well as the growth during aging. For the inhibition behavior of rare earth element in the intermetallic compound growth, Zhang [12] used to demonstrate that adding a small amount of Ce into the SnAgCu solder can refine the microstructures, decreased the thickness of the intermetallic compound layer of SnAgCu solder on Cu substrate subjected to thermal cycling and isothermal aging.…”