2003
DOI: 10.1103/physrevb.67.075402
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Interface structure of Fe/Ag multilayers prepared by pulsed laser deposition

Abstract: Fe/Ag multilayers with single layer thicknesses in the nanometer range have been deposited on Si͑100͒ using pulsed laser deposition. Conversion electron Mössbauer spectroscopy in conjunction with Rutherford backscattering spectrometry and x-ray reflectivity have been used for the evaluation of the interface structure of these multilayers. In the Fe-Ag system, with a large positive heat of mixing, a solid solution of bcc Fe͑Ag͒ has been found by placing an enriched 57 Fe marker layer at different distances to t… Show more

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Cited by 17 publications
(14 citation statements)
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“…It is generally accepted that the special features or improved performance relate to their different microstructure when compared to systems produced using conventional techniques. [1][2][3][4] The high kinetic energy of species arriving to the substrate is the most widely reported reason for these differences, but their presence can also lead to undesired processes such as resputtering of deposited species, [4][5][6][7] mixing or alloying at the interface, 8 or subsurface implantation. 4,6,7 The complete origin of many of these processes is not yet well understood in part due to the lack of detailed information on the actual kinetic energy of the species reaching the substrate in a broad laser fluence range, since average or mean values are typically reported rather than velocity distributions.…”
Section: Introductionmentioning
confidence: 99%
“…It is generally accepted that the special features or improved performance relate to their different microstructure when compared to systems produced using conventional techniques. [1][2][3][4] The high kinetic energy of species arriving to the substrate is the most widely reported reason for these differences, but their presence can also lead to undesired processes such as resputtering of deposited species, [4][5][6][7] mixing or alloying at the interface, 8 or subsurface implantation. 4,6,7 The complete origin of many of these processes is not yet well understood in part due to the lack of detailed information on the actual kinetic energy of the species reaching the substrate in a broad laser fluence range, since average or mean values are typically reported rather than velocity distributions.…”
Section: Introductionmentioning
confidence: 99%
“…1,2 However, much less attention has been paid to the production of metals despite early attempts to synthesize them in the 1970s. 3 More recently, the interest in complex thin film metal nanostructures such as metal-dielectric or metal multilayers, 4,5 as well as metal nanoparticles, [6][7][8] has triggered new efforts to use PLD for metal deposition. These metal structures are characterized by the localization and enhancement of the electric and magnetic fields, leading to effects such as giant magnetoresistance, 9 enhanced nonlinear optical properties, 8 or enhanced Raman response, 10 among others.…”
Section: Introductionmentioning
confidence: 99%
“…[11][12][13][14] Both characteristics are expected to have a strong influence on the features of the metal structures produced. 6,15 In addition, the presence of highly energetic species may induce undesired processes such as selfsputtering, also termed resputtering, of a fraction of the material that is being deposited 14,[16][17][18][19] or an increase of surface roughness, 4 among others. Finally, both self-sputtering and backscattering of a fraction of the incident species may have a significant effect on the morphology of the nanoparticles due to their nanometric dimensions.…”
Section: Introductionmentioning
confidence: 99%
“…However, the presence of species having high kinetic energies is a concern due to effects that can be undesired, such as resputtering or self-sputtering of the deposited species, 3,8 mixing or alloying at the interface, 1,2 subsurface implantation 2,3 or even defect formation. It is well known that high kinetic energy species bombarding a surface can affect the deposition process.…”
Section: Introductionmentioning
confidence: 99%