Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications

Abstract

Diamond/Cu-xCr composites were fabricated by pressure infiltration process. The thermal conductivities of diamond/Cu-xCr (x = 0.1, 0.5, 0.8) composites were above 650 W/mK, higher than that of diamond/Cu composites. The tensile strengths ranged from 186 to 225 MPa, and the bonding strengths ranged from 400 to 525 MPa. Influences of Cr element on the thermo-physical properties and interface structures were analyzed. The intermediate layer was confirmed as Cr 3 C 2 and the amount of Cr 3 C 2 increased with the increase of Cr concentration in Cu-xCr alloys. When the Cr concentration was up to 0.5 wt.%, the content of the Cr 3 C 2 layer was constant. As the thickness of the Cr 3 C 2 layer became larger, the composites showed a lower thermal conductivity but higher mechanical properties. The coefficients of thermal expansion (CTE) of diamond/Cu-xCr (x = 0.1, 0.5, 0.8) composites were in good agreement with the predictions of the Kerner' model.

Effect of molybdenum as interfacial element on the thermal conductivity of diamond/Cu composites

“…8. The interfacial This can be explained by no chemical affinity between copper and diamond, and therefore no interfacial bonding and no electron-phonon coupling for an optimum thermal transfer at the interface [24], indicating that the influence of the poor interfacial adhesion is prominent over any effect that might be introduced through the addition of Mo coating of diamond.…”

Mechanical properties of a diamond–copper composite with high thermal conductivity

“…A balance of high values for strength and thermal conductivity for a diamond-copper composite was achieved in [61]. Composites were prepared by infiltration of Cu-Cr alloys with different chromium contents -from 0.1 to 0.8% (wt.).…”

Chromatographic separation of In(III) from Cd(II) in aqueous solutions using commercial resin (Dowex 50W-X8)

“…The surface of the sorbent carries positive charges at pH values lower than the IEP, which enhances the electrostatic force of attraction with InCl 3 . (In the system studied, the main chemical species of indium in solutions is InCl 4 - [18]). As a result, the process of sorption takes place more easily in a pH range of 2-4, so the adsorption percentage of In(III) is higher.…”

“…As a result, the process of sorption takes place more easily in a pH range of 2-4, so the adsorption percentage of In(III) is higher. At pH <2, there is a balance reaction: H + + InCl 4 HInCl 4 . As a result, the main chemical species of In(III) becomes HInCl 4 [19][20][21], so the adsorption percentage of In(III) is lower.…”

“…Cyclotron-produced 111 In is widely used in nuclear medicines for labeling blood cell elements and monoclonal antibodies. 111 In was produced by the 111 Cd (p, n), 111 In and 112 Cd (p,2n) 111 In nuclear reactions at the MGC-20E Cyclotron [4].…”