Interfacial Microstructures and Thermodynamics of Thermosonic Cu-Wire Bonding

Li, Junhui; Linggang, Liu; Deng, Lei; Ma, Biao; Wang, Fuliang; Han, Lei

doi:10.1109/led.2011.2161749

Cited by 79 publications

(23 citation statements)

References 22 publications

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“…[10][11][12][13] For example, bonding pressure of microelectronics packaging equipment needs to be applied to the stable load of 5N, [14][15][16][17][18] and damping force of micro-mechanical damping system is only 20N. 19,20 Recently, some small MRF dampers are developed, such as the RD-1097-01X damper is the smallest commercial damper, whose force is still 100N. 21 The structure of the traditional MRF damper is shown in Figure 1.…”

Section: Introductionmentioning

confidence: 99%

Mathematical model of a novel small magnetorheological damper by using outer magnetic field

Huang

Zhu

2017

AIP Advances

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In order to realize small loading and small damping, a mini Magneto-rheological fluid (MRF) damper is suggested by using new method of outer coils, and its physical model is established firstly. It was found that the landing force is only 1.74∼8N, the landing force is the third-order function with the current by polynomial fitting of the experimental data, which shows a force-current model. The results of force-displacement and force-velocity indicate that it has nonlinear hysteretic damping characteristics. Based on the new mini-mode principle and the damping characteristics, an improved nonlinear dynamics model is proposed, and its parameter expressions are obtained by parameter identification and regression fitting. Model curves fit well with experimental curves, and the improved model has fully demonstrated the dynamic characteristics of the mini-MRF damper. It will provide scientific method and physical model for the small MRF damper development.

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Section: Introductionmentioning

confidence: 99%

Mathematical model of a novel small magnetorheological damper by using outer magnetic field

Huang

Zhu

2017

AIP Advances

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“…The intermetallic phases Al 2 Au, AlAu 4 , or Al 3 Au 8 were formed at the Au-Al bond interface, and the thickness of the intermetallic phases was 100-300 nm. The microstructural characteristics of Au/Al bonded interfaces were examined [15][16][17]. Atomic diffusion took place at the bond interface to enhance the microstructural strength aspects, which increased beyond that of the base materials.…”

Section: Introductionmentioning

confidence: 99%

Characterization of microstructure, toughness, and chemical composition of friction-welded joints of UNS S32205 duplex stainless steel

2014

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Friction welding is a solid-state joining process which is applied extensively because of its advantages such as low heat input, efficient application, ease in manufacturing, and environmental friendliness. The present study investigates the mechanical and metallurgical properties of UNS S32205 duplex stainless steel frictionwelded joints. The process parameters, namely friction pressure, upsetting pressure, and rotational speed are individually varied from low level to high level (within the range of the machine setup) and their effects on the joint properties are analyzed. The partial-deformation zone had higher hardness than the weld and base metal. The toughness of the joints was evaluated at room temperature and at subzero temperature conditions. The impact toughness of the friction-welded joints was found to be superior to fusion-joined duplex stainless steel in room and cryogenic conditions.

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“…Copper foil will CONTACT Chuanjie Wang cjwang@hitwh.edu.cn; wcjhit@.com Color versions of one or more of the figures in the article can be found online at www.tandfonline.com/ginf. be a new kind of potential substrate materials if the corresponding bonding process is developed [7][8][9][10][11]. However, most current works have been done on seeking higher cost-efficiency wire material, designing bonding equipment of better performance, analyzing of bonding mechanism and optimizing of bonding process, and so on [12,13].…”

Section: Introductionmentioning

confidence: 99%

Effect of ultrasonic parameters on bonding quality of rolled T2 copper foil and Au wire

Zhang

Zhu

Chen

et al. 2016

Integrated Ferroelectrics

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In this paper the effect of ultrasonic parameters on ball bonding quality of T2 copper foil and gold wire was investigated experimentally. The results indicate that a better bonding quality was obtained under the ultrasonic power range from 185 mw to 195 mw and the ultrasonic time range from 160 ms to 180 ms. Both the positive and negative effects of ultrasonic power lead to the fluctuation of bonding quality. Ultrasonic time was the factor which intensified the bonding effect whose influence was less obvious. Through the analysis of morphology of bonding joint and bonding section, bonding joint was composed of rim flashes, bonding area and residual tail wire, bonding specimens were well bonded for the radial resistance of streamlines. This was different to conventional bonding process that the central bonding region of which usually appeared unbonded area.

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Interfacial Microstructures and Thermodynamics of Thermosonic Cu-Wire Bonding

Cited by 79 publications

References 22 publications

Mathematical model of a novel small magnetorheological damper by using outer magnetic field

Mathematical model of a novel small magnetorheological damper by using outer magnetic field

Characterization of microstructure, toughness, and chemical composition of friction-welded joints of UNS S32205 duplex stainless steel

Effect of ultrasonic parameters on bonding quality of rolled T2 copper foil and Au wire

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