Interfacial reaction of a Sn‐3.0Ag‐0.5Cu thin film during solder reflow

Lee, Liu Mei; Haliman, Habsah; Mohamad, Ahmad Azmin

doi:10.1108/09540911311294560

Cited by 17 publications

(1 citation statement)

References 34 publications

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“…Several studies for the IMC formation and growth in the reflow process have been developed. Many researchers proved that the thickness of IMC after the reflow process is controlled by reflow time and temperature [4][5][6]. Pan reported that the IMC thickness increased with higher reflow peak temperature and longer time above liquidus.…”

Section: Introductionmentioning

confidence: 99%

Effect of the reflow process on IMC growth for different devices and complex components

Cui¹,

Tian²,

Zhao³

et al. 2022

Smart Mater. Struct.

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Intermetallic compound (IMC), as an inevitable part between pad and solder, has a severe effect on the strength and reliability of microelectronic interconnection. Here, an investigation was carried out on IMC growth for different devices and complex components. The device-level experiments were conducted with five factors: peak temperature, time duration above solder liquidus temperature, the thickness of solder paste, surface finish types, and package types including BGA and QFP. Meanwhile, four complex components with the same reflow profile were conducted and compared for component-level experiments. A scanning electron microscopy was used to measure the thickness and determine the spatial distribution of the elements through the intermetallic compound. The multivariate analysis of the formation and growth of IMC during reflow soldering was studied based on Nernst-Shchukarev's equation and the results of the experiments. The difference in IMC thickness between BGA and QFP with different factors was discussed and compared separately. The results showed that the peak temperature and time above liquidus played a vital role in the IMC growth and the solder paste thickness and different pad metallization could not be ignored. SEM pictures of the solder and statistical results were revealed that the surface finish type has a marked impact on the formation of the IMC. For PCB with numbers of components, the IMC thickness and uniformity of solder joints at corner and center positions showed some regularity differences. Meanwhile, the bump shape (Cu1-xNix)6Sn5 IMC was observed for small size BGA with ENIG during the reflow process. The results have a significant meaning to optimize its reflow process parameters for complex components, to improve the interconnection reliability in engineering.

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Section: Introductionmentioning

confidence: 99%