Interfacial reaction of reballed BGAs under isothermal aging conditions

Nie, Lei; Dong, Mingzhi; Cai, Jian; Osterman, Michael; Pecht, Michael

doi:10.1109/icept.2009.5270671

Cited by 1 publication

(2 citation statements)

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“…14. In past studies [11], [12], [14], it was discovered that there was a higher local stress concentration at the inner fillet surface of the bulk solder behind the heel of the lead. Based on this past knowledge and observation of the crack path in this study, it is likely that the crack initiated at the inner fillet (location 3) behind the heel, propagated under the lead (location 2), and finished out at the toe (location 1).…”

Section: Microsectional Analysismentioning

confidence: 99%

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Reliability of gull-wing and leadless packages subjected to temperature cycling after rework

Chai

Osterman

Pecht

2012

IEEE Trans. Device Mater. Relib.

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An experimental study was conducted to determine the effect of rework on the quality and reliability of surface mount solder interconnects. The test vehicle included thin small outline packages (TSOPs) and 2512 resistors assembled onto circuit cards with Sn3.0Ag0.5Cu and Sn63Pb37 solders. The rework process entailed the removal and replacement of the TSOPs and resistors. Reworked assemblies were then subjected to a temperature cycling test. Test results indicated that rework did not degrade the reliability of the TSOP solder attachments, but it decreased the thermal fatigue life of 2512 resistors down by 80% due to the decreased and uneven solder joint heights created by the handsoldered rework process. Solder interconnect material changes caused by the rework process were not observed to be a significant factor in reliability.

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Section: Microsectional Analysismentioning

confidence: 99%

“…Rework of plated through hole and ball grid array (BGA) assemblies has been addressed in the past [6], [7], [11], [12]. However, very limited literature has investigated the effect of rework on gull-wing type of packages and chip components [1], [13].…”

Section: Introductionmentioning

confidence: 99%