Interfacial reactions between Cu and SnAgCu solder doped with minor Ni

Cheng, Hsu-Yung; Huang, Chenfu; Lee, Hsuan; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih‐Ming

doi:10.1016/j.jallcom.2014.10.121

Cited by 43 publications

(13 citation statements)

References 20 publications

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“…A new IMC was formed at the Cu 6 Sn 5 /Cu interface after longer L/S reaction times (10, 30, and 60 min) as seen in Figure 2 b–d, and it was confirmed as the Cu 3 Sn phase according to the EDX results (74.8 at.% Cu, 25.2 at.% Sn). The phase formation of Cu 6 Sn 5 and Cu 3 Sn at the SAC305/Cu interface subjected to L/S reaction was consistent with previous studies [ 5 , 24 ]. For the Cu 6 Sn 5 phase in the early stage of L/S reaction (L/S-1 sample) in Figure 2 a, it grew in the form of small granules at the interface, and its average thickness was 2.65 µm.…”

Section: Resultssupporting

confidence: 92%

“…Soldering is a joining technology widely used to construct the electrical connection and mechanical support in between heterogeneous components in microelectronic products. This joining technology is accomplished by means of the liquid/solid (L/S) reaction, commonly called the reflow reaction, at a proper temperature, during which a low-melting-point alloy melts and reacts with the metallization of high melting points on two adjoining components [ 1 , 2 , 3 , 4 , 5 , 6 ]. Sn-based alloys such as SnAg and SnAgCu have a moderate melting point around 217–220 °C, making them suitable as joining materials.…”

Section: Introductionmentioning

confidence: 99%

“…Due to superior electrical and thermal properties, Cu is commonly used as the material for metallization in microelectronic products. Therefore, the liquid/solid reaction study of solder joints constructed using Sn-based alloy and Cu is an attractive and practically important issue [ 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 , 11 ].…”

Section: Introductionmentioning

confidence: 99%

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Effects of Initial Morphology on Growth Kinetics of Cu6Sn5 at SAC305/Cu Interface during Isothermal Aging

Lee

Chen

2022

Materials

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Solder/Cu joints are important components responsible for interconnection in microelectronics. Construction of the solder/Cu joints through liquid/solid (L/S) reactions accompanies the formation of the Cu–Sn intermetallic compounds (IMCs) at the joint interface. The Cu6Sn5 IMC exhibits remarkable distinctions in thickness and morphology upon increasing the L/S reaction time. Effects of the initial characteristics of thickness and morphology on the growth kinetics of Cu6Sn5 during subsequent isothermal aging were investigated. SAC305 solder was reflowed on a Cu electroplated layer at 265 °C for 1 to 60 min to produce the Cu6Sn5 IMC with different thickness and morphology at the SAC305/Cu interface. The as-fabricated SAC305/Cu joint samples were aged at 200 °C for 72 to 360 h to investigate the growth kinetics of Cu6Sn5. The results show that the initial characteristics of thickness and morphology significantly influenced the growth kinetics of Cu6Sn5 during the subsequent solid/solid (S/S) reaction. A prolonged L/S reaction time of 60 min (L/S-60) produced a scallop-type Cu6Sn5 IMC with a larger grain size and a thicker thickness, which reduced the quantity of fast diffusion path (grain boundary) and the magnitude of concentration gradient, thus slowing down the growth rate of Cu6Sn5. According to the growth kinetics analysis, the growth rate constant of Cu6Sn5 could be remarkably reduced to 0.151 µm/h0.5 for the L/S-60 sample, representing a significant reduction of 70 % compared to that of the L/S-1 sample (0.508 µm/h0.5 for L/S reaction time of 1 min).

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Section: Resultssupporting

confidence: 92%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Effects of Initial Morphology on Growth Kinetics of Cu6Sn5 at SAC305/Cu Interface during Isothermal Aging

Lee

Chen

2022

Materials

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“…Also, it decreased the Ag 3 Sn and Cu 6 Sn 5 IMCs, which enhanced the yield strength and ultimate tensile strength but decreased the total elongation. It was concluded by Cheng et al [20] that minor Ni addition to SAC105/Cu increased Cu 6 Sn 5 layer growth, but the Cu 3 Sn growth was obstructed through the subsequent aging of the solid-state. Zn's impact was examined by Song et al [21] on microstructure evolutions and tensile properties of SAC105 solder.…”

Section: Introductionmentioning

confidence: 98%

Effect of Bi Content on the Microstructure and Mechanical Performance of Sn-1Ag-0.5Cu Solder Alloy

2021

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The purpose of this work is to explore the impact of 0.5, 1.5, 2.5 and 3.5 wt.% Bi additions on the microstructure and mechanical performance of Sn-1Ag-0.5Cu solder alloy. Scanning electron microscope (SEM) and X-ray diffraction (XRD) were utilized to examine the microstructure of the present solders. Creep measurements have been used for the preliminary assessment of mechanical properties. The steady-state creep rate, έst, diminished as the Bi’s concentration increased and reached 2.5 wt.%, with this trend altering above this point. Furthermore, increasing the aging or testing temperature caused the έst values to increment for all the investigated solders. έst variations with different Bi content and aging temperature were observed by examining the Sn-Ag-Cu solders’ structural evolutions. The mean value of the activation energy of all investigated solder alloys was found to be ∼52 kJ/mol. This value is appropriate to that quoted for the dislocation climb through the core diffusion as the dominant operating mechanism. The XRD findings supported the microstructure and lattice parameters variations with both aging temperatures and bismuth concentrations.

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“…El-Daly et al (2015a) noted that adding small amounts of Bi into Sn-1.5Ag-0.7Cu solder reduced the undercooling, refined the microstructure and diminished the nucleation rate of intermetallic compounds (IMCs) and increased the creep resistance and fracture lifetime of the solder. Cheng et al (2015) reported that the addition of low levels of Ni into Sn-1.0Ag-0.5Cu solder enhanced the growth of Cu 6 Sn 5 IMC, but inhibited Cu 3 Sn IMC growth during the solid-state ageing process. Despite the performance improvements achieved in low-Ag content solders by adding small amounts of alloying elements (such as Al, Zn, Pr, Fe, Bi and Ni), thus far, a few studies have been conducted on the reinforcement of the SAC solder by Mn particles.…”

Section: Introductionmentioning

confidence: 99%

Effects of Mn nanoparticle addition on wettability, microstructure and microhardness of low-Ag Sn-0.3Ag-0.7Cu-xMn(np) composite solders

Tang

Luo

et al. 2018

SSMT

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Purpose The purpose of this paper is to investigate of the effects of Mn nanoparticle addition on the wettability, microstructure and microhardness of SAC0307-xMn(np) (SAC: Sn–Ag–Cu; x = 0, 0.02, 0.05, 0.1 and 0.3 Wt.%) composite solders. Design/methodology/approach The SAC0307-xMn(np) composite solders were prepared by mechanically mixing different weight percentages of Mn nanopowders into the SAC0307 solder paste with rosin flux. In this study, the wettability of the solders was studied using contact angle and spread ratio methods. Afterward, the microstructure of the solders was investigated using scanning electron microscopy, energy-dispersive X-ray spectroscopy and X-ray diffractometry. Moreover, the microhardness of the solders was studied. Findings The wetting process of SAC0307-xMn(np) composite solders was found to experience four stages. Adding a small amount of Mn nanoparticles (x = 0.05 Wt.%) could improve the wettability compared to Mn-free solder. Beyond this level, the wettability deteriorated. The addition of Mn nanoparticles significantly refined the size and spacing of Ag3Sn grains in the solder matrix. When 0.1 Wt.% Mn nanoparticles was added, both the average size of the Ag3Sn grains and the spacing between the Ag3Sn grains decreased significantly and approached minimum values. Beyond this amount, the size and spacing between Ag3Sn grains increased slightly but remained smaller than those in the Mn-free solder matrix. The refined Ag3Sn grains increased the microhardness of the Mn-containing composite solders by 6-25 per cent, in good agreement with the prediction of the classic theory of dispersion strengthening. Originality/value The paper demonstrates that Mn nanoparticle addition could improve the SAC0307-xMn(np) solder wettability and reduce the grain size and spacing between Ag3Sn grains. The enhancement of the solder microhardness shows good correlation with the microstructure.

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Interfacial reactions between Cu and SnAgCu solder doped with minor Ni

Cited by 43 publications

References 20 publications

Effects of Initial Morphology on Growth Kinetics of Cu6Sn5 at SAC305/Cu Interface during Isothermal Aging

Effects of Initial Morphology on Growth Kinetics of Cu6Sn5 at SAC305/Cu Interface during Isothermal Aging

Effect of Bi Content on the Microstructure and Mechanical Performance of Sn-1Ag-0.5Cu Solder Alloy

Effects of Mn nanoparticle addition on wettability, microstructure and microhardness of low-Ag Sn-0.3Ag-0.7Cu-xMn(np) composite solders

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