Interfacial thermal conductance in rapid contact solidification process

The Effects of Surface Roughness and Metal Temperature on the Heat-Transfer Coefficient at the Metal Mold Interface

“…[27][28][29][30] Whereas previous work has determined that there is an inverse relationship between the magnitude of the air gap and that of the heat-transfer coefficient, little is known about the precise relationship of the two. The limited number of techniques that have attempted to measure the air gap and the heat-transfer coefficient attests to the complexity of the issue.…”

Melt spreading code assessment, modifications, and application to the EPR core catcher design.

“…The underlying reason was the large calculated convective heat transfer losses to the substrate due to the low Prandtl number for these metallic fluids. Based on findings from earlier work, 18,[30][31][32] this shortcoming was addressed by adding the ability to model an interfacial heat transfer resistance between melt and substrate, with the heat transfer resistance is left as a user-defined input constant. With this change, the new problem was how to best fit the model to the dataset given the fact that the interfacial heat transfer resistance, h R , constituted a second independent variable to adjust in the analysis.…”

“…This is important in terms of calculating spreading behavior for metallic melts, for which shrinkage at the melt -substrate interface can have a marked effect on local heat transfer rate. 18,[30][31][32] Finally, of the thermo-physical properties affecting spreading, viscosity is the most important. 17 The initial code version used the Ishii-Zuber 33 correlation to account for the effects of solids buildup in the melt on increasing corium viscosity.…”

Heat flux transients at the solder/substrate interface in dip soldering

“…The formation of solid shell transforms the interface from a solid-liquid to solid-solid contact. This change is associated with decrease in the thermal contact conductance (heat transfer coefficient) 3 . The decrease in heat transfer coefficient and the continuous decrease in the temperature difference (ΔT) between the probe surface and surrounding liquid solder, results in the decrease in the heat competing phenomena active at the interface; (i) the increasing thermal contact conductance between melt and the substrate surface (ii) decreasing temperature difference between the melt and the substrate surface.…”

“…Therefore techniques that are used for estimation of heat flux transients in casting process can be used to asses the heat transfer during soldering process. Several researchers have attempted to measure the interfacial heat flux, utilizing measured temperatures in both casting and mold materials, by inverse heat conduction (IHC) method for metal casting processes [2][3][4][5][6][7][8][9][10] . In these methods, the boundary heat flux is not known initially but is calculated from the temperature-time history in the mold at a known location during casting solidification.…”