Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

Kotadia, Hiren; Mokhtari, Omid; Clode, Michael; Green, Mark; Mannan, Samjid H.

doi:10.1016/j.jallcom.2011.09.024

Cited by 112 publications

(54 citation statements)

References 41 publications

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“…Kotadia et al studied the addition of 0.5-1.5 mass% Zn to SnAgCu solder 17) . They showed that the addition of 0.5 mass% Zn, causes it to diffuse into the IMC to form (Cu, Zn) 6 Sn 5 and as the content of Zn increases to 1.5 mass%, the Cu 5 Zn 8 IMC layer formed on top of the (Cu, Zn) 6 Sn 5 and Cu 3 Sn IMC layers and acts as a barrier layer by stopping the further diffusion of Sn from the solder and Cu from the substrate, thus limiting the Cu 6 Sn 5 layer thickness during the high-temperature aging.…”

Section: Introductionmentioning

confidence: 99%

Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate

et al. 2016

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A comparative study of the formation, growth, and morphology of the interfacial intermetallic compounds (IMCs) of the eutectic Sn-Bi and Sn-Bi-Zn solder joints was conducted, and the shear strengths of the two solder joints were evaluated. The cross-sectional microstructures of the joints were investigated and the fracture surfaces of the joints were examined after the shear tests. The results of the microstructural analysis of the joints indicated that the addition of Zn suppressed the growth of the interfacial IMCs signi cantly after both re ow and thermal aging. Although the shear-test results indicated that the addition of Zn decreased the shear strength of the Sn-Bi solder joint, the fracture surface examination after the shear tests revealed the cause of the degradation of the shear strength and a possible solution to prevent this degradation is suggested in the paper.

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Section: Introductionmentioning

confidence: 99%

Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate

et al. 2016

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“…5 Recent advances in nanoparticle synthesis and processing have led to the possibility of introducing components into the solder in nanoparticle form, [7][8][9][10] thus extending the range of possible solder paste systems and leading to increased interest in solders containing reactive elements. One potential method for improving solder joint reliability is to add chemically reactive elements, such as Al 11 and Zn, [12][13][14] to the solder to modify the IMC and to form in situ barrier layers that prevent continuous IMC growth during service.…”

Section: Introductionmentioning

confidence: 99%

Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

Kotadia

Panneerselvam

Mokhtari

et al. 2012

Journal of Applied Physics

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The interfacial intermetallic compound (IMC) formation between Cu substrate and Sn-3.8Ag-0.7Cu-X (wt.%) solder alloys has been studied, where X consists of 0–5% Zn or 0–2% Al. The study has focused on the effect of solder volume as well as the Zn or Al concentration. With low solder volume, when the Zn and Al concentrations in the solder are also low, the initial Cu-Zn and Al-Cu IMC layers, which form at the solder/substrate interface, are not stable and spall off, displaced by a Cu6Sn5 IMC layer. As the total Zn or Al content in the system increases by increasing solder volume, stable CuZn or Al2Cu IMCs form on the substrate and are not displaced. Increasing concentration of Zn has a similar effect of stabilizing the Cu-Zn IMC layer and also of forming a stable Cu5Zn8 layer, but increasing Al concentration alone does not prevent spalling of Al2Cu. These results are explained using a combination of thermodynamic- and kinetics-based arguments.

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“…Plus, this temperature also falls below the desired soldering temperature of 250°C. The pasty range meanwhile, is the difference between the melting temperature (T M ) and the solidus temperature (T S ) and is one of the important factors that influence in providing a fine microstructure [27,31]. The pasty range was T R =3.7ºC for this SAC solder alloy.…”

Section: Melting Propertiesmentioning

confidence: 94%

A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

Singh

Noor

2015

MATEC Web of Conferences

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Abstract. Solder alloys are one of the most crucial aspect linking the electrical components to the printed circuit board PCB substrate. Thus, producing a good solder is a must to say in electronic industries. Among major functions of solder alloys are to provide beneficial properties in melting, microstructure and mechanical strand. In this aspect, the Sn-3.8Ag-0.7Cu (SAC) solder alloys are recommended as potential candidate to assure these benefits. In this study, the solder possesses melting temperature of, T M=227°C which is below the desired soldering temperature, T M=250°C. Besides, this SAC solder produces well-defined microstructures with Sn-matrix and eutectic phase consisting Cu 6Sn5 and Ag3Sn displayed from SEM image, contributes in harvesting good mechanical properties. The SAC solder also provides a high hardness value with an average of 14.4Hv for Vickers hardness. All these results seem to satisfy the need of a viable solder alloy.

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Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

Cited by 112 publications

References 41 publications

Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate

Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate

Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

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