Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates

Dariavach, N.; Callahan, P.; Liang, Jin; Fournelle, R.A.

doi:10.1007/s11664-006-0152-7

Cited by 88 publications

(26 citation statements)

References 23 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Since 84-3-3-10 solder alloys contained more In than 89-3-3-5, the higher In content can be reasonably assumed to inhibit the dissolution of Cu. The apparent activation energies in this study were of the same order of magnitude as the apparent activation ener- gies, 28.9 kJ/mol, in In49Sn/Cu [15], 22.2 kJ/mol in SnCu/Cu and 38.1 kJ/mol in SnAgCu/Cu [27]. The apparent activation energy obtained from the aforementioned data on Pb-free solders still differed from our results by a factor of two.…”

Section: Resultscontrasting

confidence: 66%

Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates

Wu¹,

Chen²,

Huang³

2009

Journal of Alloys and Compounds

View full text Add to dashboard Cite

Section: Resultscontrasting

confidence: 66%

Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates

Wu¹,

Chen²,

Huang³

2009

Journal of Alloys and Compounds

View full text Add to dashboard Cite

“…Consequently, IMC phases start to nucleate and grow at the interface. 20 The chemical composition of the IMCs revealed that they were composed of Cu and Sn atoms. EDS analysis was carried out to identify the IMCs at the interface.…”

Section: Resultsmentioning

confidence: 99%

Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates

Sona

Prabhu

2016

Journal of Elec Materi

View full text Add to dashboard Cite

The effect of reflow time on wetting behavior of Sn-2.5Ag-0.5Cu lead-free solder on bare and nickel-coated copper substrates has been investigated. The solder alloy was reflowed at 270°C for various reflow times of 10 s, 100 s, 300 s, and 500 s. On bare copper substrate, the intermetallic compound (IMC) thickness increased with increase in reflow time, whereas on Ni-coated Cu substrate, the IMC thickness increased up to 300 s followed by a drop for solder alloy reflowed for 500 s. The spreading behavior of the solder alloy was categorized into capillary, gravity (diffusion), and viscous zones. Gravity zone was obtained from 3.8 ± 0.43 s to 38.97 ± 3.38 s and from 5.99 ± 0.5 s to 77.82 ± 8.84 s for the Sn-2.5Ag-0.5Cu/Cu and Sn-2.5Ag-0.5Cu/Ni/Cu system, respectively. Sn-2.5Ag-0.5Cu solder alloy was also reflowed for the period corresponding to the end of the gravity zone (40 s and 80 s on bare and Nicoated Cu, respectively). The joint strength was maximum at reflow time of 40 s and 80 s for the Sn-2.5Ag-0.5Cu/Cu and Sn-2.5Ag-0.5Cu/Ni/Cu system, respectively. The dynamic contact angle at the end of the gravity (diffusion) zone (h gz ) was found to be a better parameter compared with the stabilized contact angle (h f ) to assess the effect of the wettability of the liquid solder on the microstructure and joint strength. The present investigation reveals the significance of the gravity zone in assessment of optimum reflow time for leadfree solder alloys.

show abstract

“…Since Sn-rich solders have excellent solderability on Cu, Cu substrate has been widely used in electronic assembly. Typically, during the soldering of Sn-Cu solder systems on Cu substrate, ƞ-Cu6Sn5 and ɛ-Cu3Sn phases are common interfacial layers that form between the solder/Cu substrate [5,59,88,89]. During the liquidsolid interaction of molten solder and Cu substrate, it is believed that a rapid dissolution of Cu into molten solder with a lower Cu concentration occurs immediately after the Cu oxide film has been removed by the actions of the flux.…”

Section: Interfacial Intermetallic Compound (Imc) Layer Of Reinforcedmentioning

confidence: 99%

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

Salleh¹,

Anuar²

View full text Add to dashboard Cite

Electronics manufacturers are pushing the limits in reducing the physical size of circuitry while simultaneously increasing the number of transistors to satisfy Moore's Law [1]. This includes investing in new materials, and configuring new ways to manufacture complex 3D (three dimensional) electronic packaging [1]. One key requirement of new materials and techniques is ensuring the high reliability of the resultant products in various challenging operating environments including thermal and mechanical extremes [2][3][4]. A viable method to enhance the properties and performance of a solder joint is by incorporation of reinforcement particles to the solder matrix, either by intrinsic or extrinsic methods. In this thesis a series of Sn-Cu Pb-free solder alloys with extrinsic or intrinsic phase reinforcement were manufactured and the microstructure and soldering behavior were investigated in detail.Additions of extrinsic reinforcement in the form of nano-sized ceramic material were made using a microwave sintering powder metallurgy (PM) method, which is a viable method to improve the mechanical and thermal properties of Pb-free solder materials. In addition, the advanced processing routes ensures a homogenous distributions of reinforcement particles is present. To investigate the performance of the reinforced bulk solders including thermal and mechanical properties and relate this to the microstructure, samples were investigated using techniques such as synchrotron micro-XRF, HRTEM, SEM, XPS, dilatometery, DSC and shear and microhardness testing. A hypothesis of how reinforcement improves solder properties is developed and discussed. Synchrotron X-ray radiography imaging (SXRI) was used to analyse the development of microstructure and the complex interactions occurring in the solders. Based on the properties of the fabricated solder, the microwave sintering PM route was discussed as a promising method for the reinforcement of Pb-free solders.The initial formation of interfacial IMC products was studied in Sn-Cu based solder alloys by in situ experiment techniques such as SXRI and UHV-TEM. The results provide direct experimental evidence of real-time initial Cu6Sn5 layer development during soldering and also the stress creation and release events that arise due to the polymorphic transformations of the Cu6Sn5 phase and the associated volumetric change.ii In addition, the nucleation and growth behavior of primary intermetallics which can be considered an intrinsic reinforcing material in solder joints was studied. Here, the nucleation and growth behavior of primary Cu6Sn5 and β-Sn crystals in some of the most commonly used solder alloys including Sn-0.7Cu and Sn-3.0Ag-0.5Cu is explained. This also includes the effects of Ni additions for refining primary Cu6Sn5 in Sn-Cu solder joints. Using SXRI, observations were made during solder joint solidification, which is difficult using conventional methods. The initial nucleation and solidification kinetics of primary Cu6Sn5 crystals were discussed.The growth of pri...

show abstract

Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates

Cited by 88 publications

References 23 publications

Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates

Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates

Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

Contact Info

Product

Resources

About