2014
DOI: 10.1115/1.4026639
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Intermittent Failures in Hardware and Software

Abstract: Intermittent failures and no fault found (NFF) phenomena are a concern in electronic systems because of their unpredictable nature and irregular occurrence. They can impose significant costs for companies, damage the reputation of a company, or be catastrophic in systems such as nuclear plants or avionics. Intermittent failures in systems can be attributed to hardware failures or software failures. In order to diagnose and mitigate the intermittent failures in systems, the nature and the root cause of these fa… Show more

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Cited by 26 publications
(23 citation statements)
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“…A forty year old paper by Malaiya and Su [30] investigated intermittent faults in integrated circuits. A similar study was made more recently by Bakhshi et al [6]. Both Malaiya and Su, and Bakhshi et al came to similar conclusions regarding intermittent faults caused by HW: temperature, loose connectors, bad soldering, corrosion, and voltage fluctuations.…”
Section: Rq1 Revisited In Light Of Related Worksupporting
confidence: 69%
“…A forty year old paper by Malaiya and Su [30] investigated intermittent faults in integrated circuits. A similar study was made more recently by Bakhshi et al [6]. Both Malaiya and Su, and Bakhshi et al came to similar conclusions regarding intermittent faults caused by HW: temperature, loose connectors, bad soldering, corrosion, and voltage fluctuations.…”
Section: Rq1 Revisited In Light Of Related Worksupporting
confidence: 69%
“…This is due to the fact that measurements from various soft-sensors carry different information about characteristics and dynamics. Another factor is transient and intermittent faults that occur sporadically during the processes [21], [22]. These faults are arbitrary and it is difficult to pinpoint their causes due to their complex nature.…”
Section: A Seagate Wafer Soft-sensing Toosletmentioning
confidence: 99%
“…For example, vibration can cause IFs of connectors and wire bonds. Coefficient of thermal expansion mismatch can cause IFs of wire bonds because of temperature change [5], [8].…”
Section: Fault Descriptionmentioning
confidence: 99%
“…The transition relationships between consecutive fault nodes from time t to time t + t are determined using the equations in Table I and (1)- (8). The total failure rate and repair rate of each component are provided in Table II.…”
Section: B Fault Diagnosis Modelingmentioning
confidence: 99%
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