Internal stress and structure of evaporated chromium and MgF2 films and their dependence on substrate temperature

Abermann, R.; Martinz, H.P.

doi:10.1016/0040-6090(84)90179-2

Cited by 31 publications

(9 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The general behavior of intrinsic stress in thin MgF 2 films is in general accordance with the results published by Abermann et al [18] who reported a change of the intrinsic stress from first tensile to compressive with increasing thickness before the intrinsic stress finally converted into tensile for larger thickness. …”

Section: Instrinsic Stress Of Fluoride Coatingssupporting

confidence: 86%

Development of mechanical stress in fluoride multilayers for UV applications

Thielsch¹,

Heber

Uhlig

et al. 2004

SPIE Proceedings

View full text Add to dashboard Cite

Since excimer laser applications extend to UV wavelengths at 193 nm and 157 nm, renewed research interest has recently arisen on fluoride thin films due to their unrivaled position as wide- band-gap material for the vacuum UV (VUV). In order to evaluate the critical development of mechanical stress in all dielectric UV mirrors a systematic study was performed on LaF 3/MgF2 and LaF3/AlF3 stacks on silica and silicon substrates. The samples, were investigated by means of complex ex - situ mechanical stress analysis including temperature dependence of stress, optical measurements, evaluation of structural and morphological parameters by AFM and XRD. When deposited at high substrate temperature of about 300°C, LaF3/MgF2 tends to show high tensile stress due to the large thermal expansion coefficient difference between the substrate and the film materials. It results in micro crack formation already starting after deposition of about 10 layer pairs. LaF3/AlF3 appears to have a larger crack resistance due to lower stress which can be correlated to the higher water content in these kind of stacks. By adjusting the deposition temperature, mirror stacks with high reflectance at 193nm can be grown

show abstract

Section: Instrinsic Stress Of Fluoride Coatingssupporting

confidence: 86%

Development of mechanical stress in fluoride multilayers for UV applications

Thielsch¹,

Heber

Uhlig

et al. 2004

SPIE Proceedings

View full text Add to dashboard Cite

show abstract

“…The self‐folding is caused by stress that develops during thermal evaporation of the metal thin films. This stress is partially due to the mismatch in the coefficient of thermal expansion of Cu (16.6 × 10 −6 °C −1 ), Cr (6.2 × 10 −6 °C −1 ),20 and the underlying polymeric sacrificial layer substrate, but mostly as a result of large intrinsic tension generated during the Cr film growth 21–24. Although Cr films have been used previously to fold structures spontaneously based on the high intrinsic stress,14, 25 the Cr/Cu/polymer trilayer hinge was developed in our group.…”

mentioning

confidence: 99%

“…This stress is partially due to the mismatch in the coefficient of thermal expansion of Cu (16.6 Â 10 À6 8C À1 ), Cr (6.2 Â 10 À6 8C À1 ), [20] and the underlying polymeric sacrificial layer substrate, but mostly as a result of large intrinsic tension generated during the Cr film growth. [21][22][23][24] Although Cr films have been used previously to fold structures spontaneously based on the high intrinsic stress, [14,25] the Cr/Cu/polymer trilayer hinge was developed in our group. This combination of materials is critical in enabling the low-temperature and on-demand assembly.…”

mentioning

confidence: 99%

Thin Film Stress Driven Self‐Folding of Microstructured Containers

Leong

Benson

Call

et al. 2008

Small

109

View full text Add to dashboard Cite

Tiny boxes: A highly parallel, low‐temperature process allows the self‐assembly of hollow, cubic microcontainers with patterned faces that can encapsulate objects within. The process is based on the self‐folding of lithographically patterned cruciforms and exploits stress inherent in thermally evaporated thin films to drive the assembly of the microstructures, which are on the order of 50–500 µm. The assembly occurs in water at 40–60 °C.

show abstract

“…After the cleaning process, the substrate was rinsed with ultrapure water and dried by an air knife consisting of a nitrogen flow. As vacuum deposition materials [16,17], granulated silver (Ag) and gold (Au) (5N, The Nilaco Co.) were prepared for the M1 and M2 layers [18][19][20][21][22][23][24][25], and granulated calcium fluoride (CaF2) [26][27][28][29][30], and magnesium fluoride (MgF2) [31][32][33][34] (Sanwa Kenma Ltd.) were used for the I layer. These materials were vacuum-evaporated by resistive heating using a tungsten (W) basket heater (Okenshoji Co., Ltd.) or a boat heater (W or Ta, The Nilaco Co.), and all three layers (M1, I, and M2) were deposited under high vacuum conditions without exposure to air.…”

Section: Sample Preparation and Measurementmentioning

confidence: 99%

Plasmonic active spectral filter in VIS-NIR region using metal-insulator-metal (MIM) structure on glass plate

Oshikane

Murai

Higashi

et al. 2012

Nanoengineering: Fabrication, Properties, Optics, and Devices IX

View full text Add to dashboard Cite

The interaction between surface plasmons at two interfaces inside a metal-insulator-metal (MIM) structure is one of the most interesting physical phenomena in nanophotonics. We are developing a plasmonic active spectral filter based on the MIM structure in order to fabricate a white light-emitting diode (LED) for visible-light communication. The development of an optical active filter in the visible region assisted by surface plasmon resonance (SPR) in the MIM structure of vacuum-deposited thin films on a glass substrate has been studied both experimentally and theoretically. The interface between the first thin silver layer (M1, around 50 nm thick) and the bulk glass slide is suitable for excitation of SPR at a particular wavelength and incident angle of optical illumination. Also, the spatial extension of the SPR wave may cause an effective propagating mode that is confined to the insulator layer (I, around 150 nm thick) by both M1 and the second thick silver layer (M2, around 200 nm thick). Such an energy conversion from the illuminating light to the propagating SPR modes corresponds to an evident absorption dip in the spectral reflectance curve of the MIM structure, and the shape of the dip may vary widely in response to the material and configuration of the MIM. The spectral and angular reflectance of the prototypical MIM structure have been measured with a spectrophotometer for P-and Spolarized light because the plasmonic effect within the MIM structure depends strongly on the polarization of light. Such a characteristic reflection feature has also been studied by using both the usual transfer matrix method and 2D electromagnetic simulations based on the finite element method. In this talk, several remarkable and preliminary MIM prototypes are introduced and discussed.

show abstract

Internal stress and structure of evaporated chromium and MgF2 films and their dependence on substrate temperature

Cited by 31 publications

References 11 publications

Development of mechanical stress in fluoride multilayers for UV applications

Development of mechanical stress in fluoride multilayers for UV applications

Thin Film Stress Driven Self‐Folding of Microstructured Containers

Plasmonic active spectral filter in VIS-NIR region using metal-insulator-metal (MIM) structure on glass plate

Contact Info

Product

Resources

About