2012
DOI: 10.1016/j.electacta.2012.07.035
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Internal stress evolution during field-induced crystallization of anodic tantalum oxide

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Cited by 15 publications
(20 citation statements)
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“…The target potential of the power supply was set to 85 V in order to obtain an ATO with a thickness of 135 nm (assuming an anodization rate of 1.6 nm/Volt 27,28 ). High surface area samples were produced by pressing 7.5 g of commercial tantalum powder with a capacitance-voltage per gram rating of 12000 uF · V/g to a press density of about 6 g/cm 3 . Subsequently, the samples were sintered at 1550…”
Section: Methodsmentioning
confidence: 99%
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“…The target potential of the power supply was set to 85 V in order to obtain an ATO with a thickness of 135 nm (assuming an anodization rate of 1.6 nm/Volt 27,28 ). High surface area samples were produced by pressing 7.5 g of commercial tantalum powder with a capacitance-voltage per gram rating of 12000 uF · V/g to a press density of about 6 g/cm 3 . Subsequently, the samples were sintered at 1550…”
Section: Methodsmentioning
confidence: 99%
“…3,26 The same technique has been used here to study internal stresses generated in ATO films during the annealing. Here, this approach is implemented in a high temperature vacuum system.…”
Section: Methodsmentioning
confidence: 99%
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“…The amorphous tantalum oxide (ATO) formed electrochemically is the dielectric layer in these capacitors [1][2][3][4][5][6][7][8]. The degradation of ATO's dielectric properties upon prolonged exposure to high electric field stress has been the focus of a large number of prior investigations [1,3,5,[9][10][11][12][13][14][15][16][17].…”
Section: Introductionmentioning
confidence: 99%