Interpretation of ICA mechanical cycling data

Abstract

Cyclic mechanical shear testing of isotropic conductive adhesives (ICAs) at ambient temperature reveals both viscoelastic behavior and a reproducible stress plateau. The failure mechanism is typically adhesive, rather than cohesive, which leads to significant deviations from the Coffin-Manson behavior expected. Tentative explanations of the viscoelasticity and plateau are offered in terms of filler particle movement and structural layering within the epoxy matrix.

Die Shear Testing of a Novel Isotropic Conductive Adhesive—Epoxy Filled With Metal-Coated Polymer Spheres

“…However, the normalized stiffnesses obtained at large strains can be used for comparing ICA-1 and ICA-3 in terms of joint stiffness at (practically relevant) large displacements. Our results are in accordance with a previous research of Morris et al [23] in which apparent shear modulus (obtained at room temperature and at large strains) of a conventional Ag-filled ICA is estimated in the same range.…”