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No abstract

Cyclic mechanical shear testing of isotropic conductive adhesives (ICAs) at ambient temperature reveals both viscoelastic behavior and a reproducible stress plateau. The failure mechanism is typically adhesive, rather than cohesive, which leads to significant deviations from the Coffin-Manson behavior expected. Tentative explanations of the viscoelasticity and plateau are offered in terms of filler particle movement and structural layering within the epoxy matrix.