Mechanical cycling of isotropic conductive adhesives

Morris, James E.; Niiranen, Sini; Mattila, Toni T.

doi:10.1109/isse.2010.5547275

Cited by 2 publications

(2 citation statements)

References 12 publications

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“…Mechanical shear cycling was employed, since ICA (and solder) failure typically occurs by shear stress for both SMT and flip-chip applications. This paper extends the analysis of the experimental results reported earlier in [5].…”

Section: Introductionsupporting

confidence: 88%

Interpretation of ICA mechanical cycling data

Morris

Niiranen

Mattila

et al. 2010

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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Cyclic mechanical shear testing of isotropic conductive adhesives (ICAs) at ambient temperature reveals both viscoelastic behavior and a reproducible stress plateau. The failure mechanism is typically adhesive, rather than cohesive, which leads to significant deviations from the Coffin-Manson behavior expected. Tentative explanations of the viscoelasticity and plateau are offered in terms of filler particle movement and structural layering within the epoxy matrix.

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Section: Introductionsupporting

confidence: 88%

Interpretation of ICA mechanical cycling data

Morris

Niiranen

Mattila

et al. 2010

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

Self Cite

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“…The mechanical durability of an isotropic CA was tested by Morris et al (2010). In this study, the shear testing was carried out at ambient temperature.…”

Section: Introductionmentioning

confidence: 99%

Mechanical durability of RFID chip joints assembled on flexible substrates

Janeczek

Serzysko

Jakubowska

et al. 2012

Soldering &Amp; Surface Mount Technology

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Purpose -The purpose of this paper is to investigate the durability of radio-frequency identification (RFID) chips assembled on flexible substrates (paper and foil), with materials evaluated with regard to mechanical stresses and dependence on the applied substrate, antenna materials, chip pad printing and chip encapsulation. Design/methodology/approach -RFID chips were assembled to antennas screen printed on flexible substrates. Shear and bending tests were conducted in order to evaluate the mechanical durability of the chip joints depending on the materials used for mounting the RFID chip structures. X-ray inspection and cross sectioning were performed to verify the quality of the assembly process. The microstructure and the resistance of the materials used for chip pads were investigated with the aim of determining the conductivity mechanism in the printed layers. Findings -Addition of carbon nanotubes to the conductive adhesive (CA) provided a higher shear force for the assembled RFID chips, compared to the unmodified conductive adhesive or a polymer paste with silver flakes. However, this additive resulted in an increase in the material's resistance. It was found that the RFID substrate material had a significant influence on the shear force of mounted chips, contrary to the materials used for printing antennas. The lower shear force for chips assembled on antennas printed on paper rather than on foil was probably connected with its higher absorption of solvent from the pastes. Increasing the curing temperature and time resulted in an additional increase in the shear force for chips assembled to antennas printed on foil. A reverse dependence was observed for chips mounted on the antennas made on paper. An improvement in the durability of the RFID chip structures was achieved by chip encapsulation. Bending tests showed that a low-melting adhesive was the best candidate for encapsulation, as it provided flexibility of the assembled structure. Research limitations/implications -Further studies are necessary to investigate the mechanical durability of RFID chips assembled with a conductive adhesive, with different addition levels and types of carbon nanotubes. Practical implications -The results revealed that the best candidate for providing the highest RFID chip durability related to mechanical stresses was the low-melting adhesive. It can be recommended for practical use, as it simplified the assembly process and reduced the curing step in the encapsulation of the RFID devices. From the results of shear testing, conductive adhesives with carbon nanotubes can be used in RFID chip assembly because of their ability to increase the shear force of joints created between the antenna and the chip. Originality/value -In this paper, the influence of the materials used for antenna, chip pads, encapsulation and the curing conditions on the mechanical durability (shear and bending) of RFID chips was analyzed. Commercial and elaborated materials were compared. Some new materials containing a conductive adhesive and carbon ...

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Mechanical cycling of isotropic conductive adhesives

Cited by 2 publications

References 12 publications

Interpretation of ICA mechanical cycling data

Interpretation of ICA mechanical cycling data

Mechanical durability of RFID chip joints assembled on flexible substrates

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