Articles you may be interested inThe effect of impurity-induced lattice strain and Fermi level position on low temperature oxygen diffusion in silicon J. Appl. Phys. 109, 063532 (2011); 10.1063/1.3555625
Nitrogen diffusion and interaction with dislocations in single-crystal siliconThe locking of dislocations by oxygen atoms in Czochralski-silicon at temperatures between 350 and 700°C has been studied. Both experimental and theoretical investigations were carried out for different oxygen concentrations, different annealing times ͑from 10 to 3ϫ10 7 s͒, and different point defect concentrations. It was found that the unlocking stress of dislocations at low temperatures follows similar trends to those previously observed at higher temperatures and is determined by annealing temperature, time, and oxygen concentration. However, in the present temperature range, experimental results indicate an enhanced transport of oxygen to dislocations. Numerical simulations solving the diffusion equation for oxygen transport to the dislocations show that the effective diffusivity of oxygen at lower temperatures diverges from ''normal'' diffusivity of oxygen. We have shown that oxygen transport can be as much as three orders of magnitude higher than that which would be assumed by extrapolation of the ''normal'' data obtained at higher temperatures. In the low temperature regime the effective diffusivity is dependent on the oxygen concentration and has an activation energy of about 1.5 eV.