disulfide (MoS 2 ) and tungsten disulfide (WS 2 ), tend to exhibit appreciable direct bandgaps and correspondingly large on/off ratios, [1] moderately high carrier mobilities, [2,3] and near minimum subthreshold swings. [4] Furthermore, novel functionalities in these materials can be realized by interfacing similar and/or dissimilar materials in the form of vertical or lateral heterostructures. [5] For example, grain boundaries (GBs) formed through vapor-phase deposition of transition metal dichalcogenide (TMD) films demonstrate gate tunable memristor behavior, which is promising for future neuromorphic computing applications. [6] Additionally, lateral heterojunctions formed between dissimilar TMDs, such as MoS 2 -WS 2 , [7,8] have been found to demonstrate excellent photoresponses and on/off ratios that exceed values achieved in the individual constituents. These systems form what is referred to as a type II junction, where the valence band maxima lies in the WS 2 while the conduction band minima lies in MoS 2 . As such, they provide a unique platform for spatial control of charge carriers within a single atomic layer. [8] Lateral heterojunctions of 2D TMDs with semimetallic 2D materials such as graphene [9,10] have also been demonstrated for realizing ultrascaled contacts for truly nanoscale electronic applications. Due to strong in-plane bonding between the atomic layers, lateral interfaces have shown to exhibit comparable or even improved electronic performance compared with vertical (van der Waals) junctions, which is particularly interesting given the few orders of magnitude smaller contact area. [10,11] The ability to tune the carrier concentration in 2D materials through gating allows for unpinning of the Fermi level and elimination of Schottky barriers resulting from band alignment in MoS 2 -graphene lateral heterojunctions. [10,11] While lateral interfaces offer various intriguing opportunities, their impact on power dissipation has been largely unexplored. For example, lattice distortions at GBs and alterations in the band structure at heterojunctions could potentially be detrimental to device performance and reliability by localizing power dissipation and inducing the formation of nanoscopic hot-spots. [12] These hot-spots can limit drive currents, [13] modify optical and electronic properties, [2,14] or induce premature Lateral heterogeneities in atomically thin 2D materials such as in-plane heterojunctions and grain boundaries (GBs) provide an extrinsic knob for manipulating the properties of nano-and optoelectronic devices and harvesting novel functionalities. However, these heterogeneities have the potential to adversely affect the performance and reliability of the 2D devices through the formation of nanoscopic hot-spots. In this report, scanning thermal micro scopy (SThM) is utilized to map the spatial distribution of the temperature rise within monolayer transition metal dichalcogenide (TMD) devices upon dissipating a high electrical power through a lateral interface. The results directly d...