Investigating Effect of Unfilled Underfills on Board Level Solder Joint Reliability of Area Array Packages under Drop Test and Thermal Cycling Test

Ibe, Edward S.; Loh, K.I.; Luan, Jing-en; Tee, Tong Yan

doi:10.1109/eptc.2005.1614469

Cited by 3 publications

(1 citation statement)

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“…In this paper, an unfilled underfill was introduced which meet the requirements to enhance drop impact performance while maintain good reliability under other board level test and good processability. The authors extend the previous work [7] with more in-depth drop test simulation and analysis.…”

Section: Introductionmentioning

confidence: 90%

Effect of Unfilled Underfills on Drop Impact Reliability Performance of Area Array Packages

Ibe¹,

Loh²,

Luan³

et al.

56th Electronic Components and Technology Conference 2006

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Board level drop test is one of the key qualification tests to ensure the solder joint reliability. It becomes critical due to leadfree solder. In this paper, we study the effect of underfills on drop test performance of a fine-pitch Ball Grid Array package (BGA), experimentally and numerically. Failure mode is also compared. There are good correlations between testing and modeling on the effect of underfill on failure modes and failure mechanisms of solder joints. Moreover, the results of testing and modeling show that important parameters affecting drop test performance are position of the package on the board, modulus of the underfill, and, circumstantially, the interfacial fracture toughness of the underfill. An unfilled underfill, as opposed to a silica-filled underfill, can provide satisfactory, or even superior, drop test performance if its interfacial fracture toughness is sufficiently high.The benefit of an unfilled underfill is better processability.

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Section: Introductionmentioning

confidence: 90%