Investigating the effect of deposition variation on the performance sensitivity of low-power gas sensors

Sadek, K.; Moussa, Walied A.

doi:10.1016/j.snb.2004.11.008

Cited by 5 publications

(10 citation statements)

References 10 publications

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“…An automated substructuring algorithm was developed, in the current study, to reduce the computational cost of the coupled multi-field RF switch model. The same algorithm was utilized, in a previous study reported by the authors, to solve the coupled electro-thermal FE problem of MEMS gas sensors [ 17 ]. In this study, the reported computational savings were in the range of 59–77 percent.…”

Section: Automated-substructuring Algorithmmentioning

confidence: 99%

A Coupled Field Multiphysics Modeling Approach to Investigate RF MEMS Switch Failure Modes under Various Operational Conditions

Sadek

Lueke

Moussa

2009

Sensors

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In this paper, the reliability of capacitive shunt RF MEMS switches have been investigated using three dimensional (3D) coupled multiphysics finite element (FE) analysis. The coupled field analysis involved three consecutive multiphysics interactions. The first interaction is characterized as a two-way sequential electromagnetic (EM)-thermal field coupling. The second interaction represented a one-way sequential thermal-structural field coupling. The third interaction portrayed a two-way sequential structural-electrostatic field coupling. An automated substructuring algorithm was utilized to reduce the computational cost of the complicated coupled multiphysics FE analysis. The results of the substructured FE model with coupled field analysis is shown to be in good agreement with the outcome of previously published experimental and numerical studies. The current numerical results indicate that the pull-in voltage and the buckling temperature of the RF switch are functions of the microfabrication residual stress state, the switch operational frequency and the surrounding packaging temperature. Furthermore, the current results point out that by introducing proper mechanical approaches such as corrugated switches and through-holes in the switch membrane, it is possible to achieve reliable pull-in voltages, at various operating temperatures. The performed analysis also shows that by controlling the mean and gradient residual stresses, generated during microfabrication, in conjunction with the proposed mechanical approaches, the power handling capability of RF MEMS switches can be increased, at a wide range of operational frequencies. These design features of RF MEMS switches are of particular importance in applications where a high RF power (frequencies above 10 GHz) and large temperature variations are expected, such as in satellites and airplane condition monitoring.

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Section: Automated-substructuring Algorithmmentioning

confidence: 99%

A Coupled Field Multiphysics Modeling Approach to Investigate RF MEMS Switch Failure Modes under Various Operational Conditions

Sadek

Lueke

Moussa

2009

Sensors

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“…In the electrothermal analysis, only the conductivity of Si3N4 and the resistivity of the heater material (Pt/Ti or polysilicon) were found to generate a significant effect on the thermal response of the modeled MEMS-based gas sensor [4]. Therefore, only the variations of these thermal/electrical parameters were considered in the current case.…”

Section: Thermal Fatigue Analysis Of the Mems-based Gas Sensormentioning

confidence: 99%

“…In previous work published by the authors, the effect of varying the thermal and electrical properties and the dimensional tolerance of various thin film layers on the Gas Detection Sensitivity (GDS) performance and the thermal response of the gas sensor was introduced [ 4 ]. This study was conducted by correlating the thermal response of the gas sensor and the experimental GDS presented by Mo et al [ 12 ].…”

Section: Gas Sensor Case Studymentioning

confidence: 99%

“…In a steady state case, the thermal equilibrium within the sensor membrane is achieved by the balance between the heat generated in the electrical resistance, through the joule effect, and the heat loss by conduction, through the cooler supportive massive legs, and by convection, through air. As for boundary conditions (BC), the temperature at the external edges of the sensor is set to hold at room temperature [ 4 ]. On the upper surface of the membrane, the heat is dissipated through convective, conductive and thermal radiation exchange with the surrounding air.…”

Section: Gas Sensor Case Studymentioning

confidence: 99%

“…Therefore, it is important at the design phase to establish a correlation between the deposition parameters and the device performance in actual operating conditions. This correlation can be established by modeling the effect of the variations in the materials characteristics generated at various stages of the microfabrication process [ 1 , 4 ]. These correlated effects can then be packaged within applied design rules; which can certainly help in the reduction of the iterative prototyping process to achieve the desired characteristics of a specific MEMS design; consequently, reducing the overall cost of the development and prototyping process.…”

Section: Introductionmentioning

confidence: 99%

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Studying the Effect of Deposition Conditions on the Performance and Reliability of MEMS Gas Sensors

Sadek

Moussa

2007

Sensors

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Abstract:In this paper, the reliability of a micro-electro-mechanical system (MEMS)-based gas sensor has been investigated using Three Dimensional (3D) coupled multiphysics Finite Element (FE) analysis. The coupled field analysis involved a two-way sequential electrothermal fields coupling and a one-way sequential thermal-structural fields coupling. An automated substructuring code was developed to reduce the computational cost involved in simulating this complicated coupled multiphysics FE analysis by up to 76 percent. The substructured multiphysics model was then used to conduct a parametric study of the MEMS-based gas sensor performance in response to the variations expected in the thermal and mechanical characteristics of thin films layers composing the sensing MEMS device generated at various stages of the microfabrication process. Whenever possible, the appropriate deposition variables were correlated in the current work to the design parameters, with good accuracy, for optimum operation conditions of the gas sensor. This is used to establish a set of design rules, using linear and nonlinear empirical relations, which can be utilized in real-time at the design and development decision-making stages of similar gas sensors to enable the microfabrication of these sensors with reliable operation.

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Multiphysics modelling of a resistive polymeric sensor for VOC

Garcı́a-Guzmán

Mendoza-Gutierrez

Velez-Enriquez

et al. 2015

2015 IEEE International Conference on Industrial Technology (ICIT)

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Investigating the effect of deposition variation on the performance sensitivity of low-power gas sensors

Cited by 5 publications

References 10 publications

A Coupled Field Multiphysics Modeling Approach to Investigate RF MEMS Switch Failure Modes under Various Operational Conditions

A Coupled Field Multiphysics Modeling Approach to Investigate RF MEMS Switch Failure Modes under Various Operational Conditions

Studying the Effect of Deposition Conditions on the Performance and Reliability of MEMS Gas Sensors

Multiphysics modelling of a resistive polymeric sensor for VOC

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