Investigating the effect of single and hybrid nanoparticles on melting of phase change material in a rectangular enclosure with finite heat source

Abstract

Summary This article presents two‐dimensional (2D) transient numerical simulation and mathematical modeling of a heat sink based on nano‐enhanced phase change materials (NePCMs) to study their performance for the cooling of an electronic component. n‐eicosane is used as a PCM and Al2O3, ZnO, CuO and Cu are used as nanoparticles in NePCMs. An electronic component is mounted in the center of the bottom wall and which an aluminum fin simulating the role of a substrate (motherboard) occupies. The NePCM completely fills the inner part of the heat sink. The NePCM store the heat generated by the protuberant electronic component. The transient regime is numerically performed adopting the finite volume method and the enthalpy‐porosity technique. It has been found that the mean heat transfer and the fluid flow structure are closely dependent on the nanoparticles type in NePCM. The addition of single NePCM, with volume fractions of 2% and 4%, decreases the electronic component operating temperature and the latent heat phase duration during which the electronic component operates safely. The hybrid NePCM shows a different behavior by decreasing the electronic component operating temperature and increasing the latent phase duration. Compared to pure PCM, by inserting a volume fraction of 4%‐Cu, the electronic component working temperature decreases by 4.69% and the latent heat phase duration decreases by 3.33%. Compared to pure PCM, hybrid nanoparticle insertion of 1%‐Al2O3 and 3%‐Cu showed a 5.77% decrease in the electronic component operating temperature and a 31.11% increase in the latent heat phase duration. By inserting hybrid nanoparticles instead of single nanoparticles, the effective thermal effusivity of NePCM is improved by 10.85%.

Numerical investigation of cross plate fin heat sink integrated with phase change material for cooling application of portable electronic devices

“…Among others, organic PCM is widely recommended because of favorable chemical and thermophysical properties such as higher value of latent heat of fusion on a volumetric basis, non-corrosiveness, high specific heat, low toxicity, congruent melting, and almost isothermal solid-liquid phase transformation. [16][17][18][19] However, organic PCM exhibits a major drawback of lower thermal conductivity value (0.1-0.3 W/m K), which decreases the rate of heat absorption and release. 20 Therefore, the addition of thermal conductivity enhancers (TCEs) inside the PCM-based heat sink (HS) has been widely studied in recent years.…”

“…The latent heat thermal energy storage system (LHTESS) involving PCMs (especially organic) is found to be very effective in stretching the overheating time of the critical components of the electronic devices subjected to an intermittent and higher value of heat flux. Among others, organic PCM is widely recommended because of favorable chemical and thermophysical properties such as higher value of latent heat of fusion on a volumetric basis, non‐corrosiveness, high specific heat, low toxicity, congruent melting, and almost isothermal solid‐liquid phase transformation 16‐19 . However, organic PCM exhibits a major drawback of lower thermal conductivity value (0.1‐0.3 W/m K), which decreases the rate of heat absorption and release 20 .…”

Interactions between hybrid nanosized particles and convection melting inside an enclosure with partially active walls: 2D lattice Boltzmann‐based numerical investigation

“…The copper nanomaterial engendered the agglomeration and sedimentation of the MWCNT, and it ultimately abated the heat storage performance of composites. Faraji et al 31 carried out 2D transient mathematical simulation of a heat sink which was filled with n ‐eicosane as the PCM, and single alumina, ZnO, CuO, and Cu nanoparticles, and hybrid 2%‐alumina, 2%‐Cu and 1%‐alumina, 3%‐Cu nanoparticles. By adding hybrid 1%‐alumina, 3%‐Cu nanoparticles rather than single nanoparticles, the effective thermal effusivity of the natural convection‐controlled NEPCM melting was enhanced by 10.85%.…”

Natural convection of water and nano‐emulsion phase change material inside a square enclosure to cool the electronic components

“…The cooling electronic component is important in order to increase electronic component efficiency. The studies 95,96 have cooled battery and electronic components by phase change material.…”